CVE-2023-33063

Known Exploited Vulnerability Entry External Catalog

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Entry Details

CVE-2023-33063

Confirmed

Yes

2023-12-05 00:00 UTC

Timestamps

2023-12-05

2023-12-05

Scope

KEV entry: Qualcomm Multiple Chipsets Use-After-Free Vulnerability | Affected: Qualcomm / Multiple Chipsets | Description: Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. | Required action: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable. | Due date: 2023-12-26 | Known ransomware campaign use (KEV): Unknown | Notes (KEV): This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110; https://nvd.nist.gov/vuln/detail/CVE-2023-33063

References
  • {'id': 'CVE-2023-33063', 'url': 'https://www.cisa.gov/known-exploited-vulnerabilities-catalog?search_api_fulltext=CVE-2023-33063'}

af9442cf-bf6a-4a3a-95e0-e90cda3e76be

405284c2-e461-4670-8979-7fd2c9755a60

2026-02-02 12:26 UTC

2026-02-06 07:17 UTC

Evidence (1)
Type Source Signal Confidence Details GCVE Metadata
vendor_report cisa-kev successful_exploitation 0.80
View details 
{
  "cwes": [
    "CWE-416"
  ],
  "date_added": "2023-12-05",
  "due_date": "2023-12-26",
  "feed": "CISA Known Exploited Vulnerabilities Catalog",
  "knownRansomwareCampaignUse": "Unknown",
  "product": "Multiple Chipsets",
  "vendorProject": "Qualcomm",
  "vulnerabilityName": "Qualcomm Multiple Chipsets Use-After-Free Vulnerability"
}
 -
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