All the vulnerabilites related to qualcomm - sd410
cve-2017-18314
Vulnerability from cvelistv5
Published
2018-09-20 13:00
Modified
2024-08-05 21:20
Severity ?
EPSS score ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ.
References
| ▼ | URL | Tags |
|---|---|---|
| https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components | x_refsource_CONFIRM | |
| https://www.qualcomm.com/company/product-security/bulletins | x_refsource_CONFIRM |
Impacted products
| Vendor | Product | Version | |
|---|---|---|---|
| ▼ | Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Version: FSM9055, FSM9955, MDM9607, MDM9640, MDM9650, MSM8909W, SD 425, SD 427, SD 430, SD 435, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016 |
|
|
|||
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cve-2018-11982
Vulnerability from cvelistv5
Published
2018-09-20 13:00
Modified
2024-08-05 08:24
Severity ?
EPSS score ?
Summary
In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure.
References
| ▼ | URL | Tags |
|---|---|---|
| https://www.qualcomm.com/company/product-security/bulletins | x_refsource_CONFIRM |
Impacted products
| Vendor | Product | Version | |
|---|---|---|---|
| ▼ | Qualcomm, Inc. | Snapdragon Mobile, Snapdragon Wear |
Version: MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016 |
|
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cve-2018-11267
Vulnerability from cvelistv5
Published
2018-09-20 13:00
Modified
2024-08-05 08:01
Severity ?
EPSS score ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.
References
| ▼ | URL | Tags |
|---|---|---|
| https://www.qualcomm.com/company/product-security/bulletins | x_refsource_CONFIRM | |
| http://www.securityfocus.com/bid/106128 | vdb-entry, x_refsource_BID |
Impacted products
| Vendor | Product | Version | |
|---|---|---|---|
| ▼ | Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Version: MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016 |
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cve-2018-11292
Vulnerability from cvelistv5
Published
2018-09-20 13:00
Modified
2024-08-05 08:01
Severity ?
EPSS score ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, lack of input validation in WLANWMI command handlers can lead to integer & heap overflows.
References
| ▼ | URL | Tags |
|---|---|---|
| https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components | x_refsource_CONFIRM | |
| https://www.qualcomm.com/company/product-security/bulletins | x_refsource_CONFIRM | |
| http://support.blackberry.com/kb/articleDetail?language=en_US&articleNumber=000051618 | x_refsource_CONFIRM |
Impacted products
| Vendor | Product | Version | |
|---|---|---|---|
| ▼ | Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Version: MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016 |
|
|
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var-201809-0049
Vulnerability from variot
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ. Snapdragon (Automobile , Mobile , Wear) Contains an access control vulnerability.Information is obtained, information is altered, and service operation is disrupted (DoS) There is a possibility of being put into a state. Qualcomm Closed-Source Components are prone to multiple unspecified vulnerabilities. An attacker can exploit these issues to perform unauthorized actions. This may aid in further attacks. These issues are being tracked by Android Bug IDs A-68326803, A-62213176, A-73539234, A-72950814, A-77484228, A-111090697, A-68326811, A-78240387, A-78239234, A-68326819, A-71501117, A-72950958, A-74236425, A-77484229, A-79419793, A-109677940, A-109677982, A-109677964, A-109678202, A-109678380, A-111091377, A-111090533, A-111093202, A-111090698, A-111093021, and A-111093167. Qualcomm MDM9206, etc. are the central processing unit (CPU) products of Qualcomm (Qualcomm) applied to different platforms. An access control error vulnerability exists in several Qualcomm Snapdragon products. Attackers can use TZ to exploit this vulnerability to clear CNOC_QDSS RG0 locked by xBL_SEC when TZ is cold started
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var-201809-0098
Vulnerability from variot
In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure. Snapdragon (Mobile and Wear) Contains a double release vulnerability.Information is obtained, information is altered, and service operation is disrupted (DoS) There is a possibility of being put into a state. Qualcomm MDM9206, etc. are the central processing unit (CPU) products of Qualcomm (Qualcomm) applied to different platforms. A double free vulnerability exists in several Qualcomm Snapdragon products. Currently there is no information about this vulnerability, please keep an eye on CNNVD or vendor announcements
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var-201809-0877
Vulnerability from variot
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20. Snapdragon (Automobile , Mobile , Wear) Contains a vulnerability related to array index validation.Information is obtained, information is altered, and service operation is disrupted (DoS) There is a possibility of being put into a state. Qualcomm Closed-Source Components are prone to multiple unspecified vulnerabilities. An attacker can exploit these issues to perform unauthorized actions. This may aid in further attacks. These issues are being tracked by Android Bug IDs A-78135902, A-66913713, A-67712316, A-79419833, A-109678200, A-78283451, A-78285196, A-78284194, A-78284753, A-78284517, A-78240177, A-78239686, A-78284545, A-109660689, A-78240324, A-68141338, A-78286046, A-73539037, A-73539235, A-71501115, A-33757308, A-74236942, A-77485184, A-77484529, A-33385206, A-79419639, A-79420511, A-109678338, and A-112279564. Qualcomm MDM9206, etc. are the central processing unit (CPU) products of Qualcomm (Qualcomm) applied to different platforms. The Core in several Qualcomm Snapdragon products has a security vulnerability. The vulnerability is caused by the program not validating the array index correctly. Attackers can exploit this vulnerability by sending malformed XML data to deviceprogrammer/firehose to cause buffer out-of-bounds writes
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var-201809-0864
Vulnerability from variot
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, lack of input validation in WLANWMI command handlers can lead to integer & heap overflows. Snapdragon (Automobile , Mobile , Wear) Contains a buffer error vulnerability.Information is obtained, information is altered, and service operation is disrupted (DoS) There is a possibility of being put into a state. Qualcomm Closed-Source Components are prone to multiple unspecified vulnerabilities. An attacker can exploit these issues to perform unauthorized actions. This may aid in further attacks. These issues are being tracked by Android Bug IDs A-68326803, A-62213176, A-73539234, A-72950814, A-77484228, A-111090697, A-68326811, A-78240387, A-78239234, A-68326819, A-71501117, A-72950958, A-74236425, A-77484229, A-79419793, A-109677940, A-109677982, A-109677964, A-109678202, A-109678380, A-111091377, A-111090533, A-111093202, A-111090698, A-111093021, and A-111093167. Qualcomm MDM9206, etc. are the central processing unit (CPU) products of Qualcomm (Qualcomm) applied to different platforms. A buffer overflow vulnerability exists in several Qualcomm Snapdragon products where the WLANWMI command handler does not perform input validation. An attacker could exploit this vulnerability to cause a denial of service or execute code
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Vulnerability from fkie_nvd
Published
2018-09-20 13:29
Modified
2024-11-21 03:43
Severity ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.
References
| ▼ | URL | Tags | |
|---|---|---|---|
| product-security@qualcomm.com | http://www.securityfocus.com/bid/106128 | Third Party Advisory, VDB Entry | |
| product-security@qualcomm.com | https://www.qualcomm.com/company/product-security/bulletins | Vendor Advisory | |
| af854a3a-2127-422b-91ae-364da2661108 | http://www.securityfocus.com/bid/106128 | Third Party Advisory, VDB Entry | |
| af854a3a-2127-422b-91ae-364da2661108 | https://www.qualcomm.com/company/product-security/bulletins | Vendor Advisory |
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"references": [
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"tags": [
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"vulnStatus": "Modified",
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Vulnerability from fkie_nvd
Published
2018-09-20 13:29
Modified
2024-11-21 03:19
Severity ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ.
References
Impacted products
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"value": "In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ."
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"tags": [
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],
"url": "https://www.qualcomm.com/company/product-security/bulletins"
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],
"sourceIdentifier": "product-security@qualcomm.com",
"vulnStatus": "Modified",
"weaknesses": [
{
"description": [
{
"lang": "en",
"value": "NVD-CWE-noinfo"
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Vulnerability from fkie_nvd
Published
2018-09-20 13:29
Modified
2024-11-21 03:43
Severity ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, lack of input validation in WLANWMI command handlers can lead to integer & heap overflows.
References
Impacted products
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"lang": "es",
"value": "En Snapdragon (Automobile, Mobile y Wear) en versiones MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660 y Snapdragon_High_Med_2016, la falta de validaci\u00f3n de entradas en los manejadores del comando WLANWMI puede conducir a desbordamiento de memoria din\u00e1mica (heap) de enteros."
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],
"id": "CVE-2018-11292",
"lastModified": "2024-11-21T03:43:04.800",
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"references": [
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{
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"sourceIdentifier": "product-security@qualcomm.com",
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"weaknesses": [
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"description": [
{
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Vulnerability from fkie_nvd
Published
2018-09-20 13:29
Modified
2024-11-21 03:44
Severity ?
Summary
In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure.
References
| ▼ | URL | Tags | |
|---|---|---|---|
| product-security@qualcomm.com | https://www.qualcomm.com/company/product-security/bulletins | Third Party Advisory | |
| af854a3a-2127-422b-91ae-364da2661108 | https://www.qualcomm.com/company/product-security/bulletins | Third Party Advisory |
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