All the vulnerabilites related to qualcomm - sd415_firmware
cve-2017-18314
Vulnerability from cvelistv5
Published
2018-09-20 13:00
Modified
2024-08-05 21:20
Severity ?
EPSS score ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ.
References
| ▼ | URL | Tags |
|---|---|---|
| https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components | x_refsource_CONFIRM | |
| https://www.qualcomm.com/company/product-security/bulletins | x_refsource_CONFIRM |
Impacted products
| Vendor | Product | Version | |
|---|---|---|---|
| ▼ | Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Version: FSM9055, FSM9955, MDM9607, MDM9640, MDM9650, MSM8909W, SD 425, SD 427, SD 430, SD 435, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016 |
|
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cve-2018-11277
Vulnerability from cvelistv5
Published
2018-09-20 13:00
Modified
2024-08-05 08:01
Severity ?
EPSS score ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
References
| ▼ | URL | Tags |
|---|---|---|
| https://www.qualcomm.com/company/product-security/bulletins | x_refsource_CONFIRM |
Impacted products
| Vendor | Product | Version | |
|---|---|---|---|
| ▼ | Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Version: MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660 |
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cve-2018-11285
Vulnerability from cvelistv5
Published
2018-09-20 13:00
Modified
2024-08-05 08:01
Severity ?
EPSS score ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, while parsing FLAC file with corrupted picture block, a buffer over-read can occur.
References
| ▼ | URL | Tags |
|---|---|---|
| https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components | x_refsource_CONFIRM | |
| https://www.qualcomm.com/company/product-security/bulletins | x_refsource_CONFIRM |
Impacted products
| Vendor | Product | Version | |
|---|---|---|---|
| ▼ | Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Version: MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016 |
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cve-2018-5871
Vulnerability from cvelistv5
Published
2018-09-20 13:00
Modified
2024-08-05 05:47
Severity ?
EPSS score ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests (for privacy reasons) is not done properly due to a flawed RNG which produces repeating output much earlier than expected.
References
| ▼ | URL | Tags |
|---|---|---|
| https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components | x_refsource_CONFIRM | |
| https://www.qualcomm.com/company/product-security/bulletins | x_refsource_CONFIRM |
Impacted products
| Vendor | Product | Version | |
|---|---|---|---|
| ▼ | Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Version: MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016 |
|
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cve-2018-11982
Vulnerability from cvelistv5
Published
2018-09-20 13:00
Modified
2024-08-05 08:24
Severity ?
EPSS score ?
Summary
In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure.
References
| ▼ | URL | Tags |
|---|---|---|
| https://www.qualcomm.com/company/product-security/bulletins | x_refsource_CONFIRM |
Impacted products
| Vendor | Product | Version | |
|---|---|---|---|
| ▼ | Qualcomm, Inc. | Snapdragon Mobile, Snapdragon Wear |
Version: MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016 |
|
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cve-2018-11267
Vulnerability from cvelistv5
Published
2018-09-20 13:00
Modified
2024-08-05 08:01
Severity ?
EPSS score ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.
References
| ▼ | URL | Tags |
|---|---|---|
| https://www.qualcomm.com/company/product-security/bulletins | x_refsource_CONFIRM | |
| http://www.securityfocus.com/bid/106128 | vdb-entry, x_refsource_BID |
Impacted products
| Vendor | Product | Version | |
|---|---|---|---|
| ▼ | Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Version: MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016 |
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cve-2018-11292
Vulnerability from cvelistv5
Published
2018-09-20 13:00
Modified
2024-08-05 08:01
Severity ?
EPSS score ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, lack of input validation in WLANWMI command handlers can lead to integer & heap overflows.
References
| ▼ | URL | Tags |
|---|---|---|
| https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components | x_refsource_CONFIRM | |
| https://www.qualcomm.com/company/product-security/bulletins | x_refsource_CONFIRM | |
| http://support.blackberry.com/kb/articleDetail?language=en_US&articleNumber=000051618 | x_refsource_CONFIRM |
Impacted products
| Vendor | Product | Version | |
|---|---|---|---|
| ▼ | Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Version: MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016 |
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"cveId": "CVE-2018-11292",
"datePublished": "2018-09-20T13:00:00",
"dateReserved": "2018-05-18T00:00:00",
"dateUpdated": "2024-08-05T08:01:52.813Z",
"state": "PUBLISHED"
},
"dataType": "CVE_RECORD",
"dataVersion": "5.1"
}
Vulnerability from fkie_nvd
Published
2018-09-20 13:29
Modified
2024-11-21 03:43
Severity ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
References
Impacted products
| Vendor | Product | Version | |
|---|---|---|---|
| qualcomm | msm8909w_firmware | - | |
| qualcomm | msm8909w | - | |
| qualcomm | msm8996au_firmware | - | |
| qualcomm | msm8996au | - | |
| qualcomm | sd210_firmware | - | |
| qualcomm | sd210 | - | |
| qualcomm | sd212_firmware | - | |
| qualcomm | sd212 | - | |
| qualcomm | sd205_firmware | - | |
| qualcomm | sd205 | - | |
| qualcomm | sd430_firmware | - | |
| qualcomm | sd430 | - | |
| qualcomm | sd450_firmware | - | |
| qualcomm | sd450 | - | |
| qualcomm | sd615_firmware | - | |
| qualcomm | sd615 | - | |
| qualcomm | sd616_firmware | - | |
| qualcomm | sd616 | - | |
| qualcomm | sd415_firmware | - | |
| qualcomm | sd415 | - | |
| qualcomm | sd617_firmware | - | |
| qualcomm | sd617 | - | |
| qualcomm | sd625_firmware | - | |
| qualcomm | sd625 | - | |
| qualcomm | sd650_firmware | - | |
| qualcomm | sd650 | - | |
| qualcomm | sd652_firmware | - | |
| qualcomm | sd652 | - | |
| qualcomm | sd810_firmware | - | |
| qualcomm | sd810 | - | |
| qualcomm | sd820_firmware | - | |
| qualcomm | sd820 | - | |
| qualcomm | sd820a_firmware | - | |
| qualcomm | sd820a | - | |
| qualcomm | sd835_firmware | - | |
| qualcomm | sd835 | - | |
| qualcomm | sd845_firmware | - | |
| qualcomm | sd845 | - | |
| qualcomm | sda660_firmware | - | |
| qualcomm | sda660 | - |
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"id": "CVE-2018-11277",
"lastModified": "2024-11-21T03:43:02.667",
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}
Vulnerability from fkie_nvd
Published
2018-09-20 13:29
Modified
2024-11-21 03:43
Severity ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.
References
| ▼ | URL | Tags | |
|---|---|---|---|
| product-security@qualcomm.com | http://www.securityfocus.com/bid/106128 | Third Party Advisory, VDB Entry | |
| product-security@qualcomm.com | https://www.qualcomm.com/company/product-security/bulletins | Vendor Advisory | |
| af854a3a-2127-422b-91ae-364da2661108 | http://www.securityfocus.com/bid/106128 | Third Party Advisory, VDB Entry | |
| af854a3a-2127-422b-91ae-364da2661108 | https://www.qualcomm.com/company/product-security/bulletins | Vendor Advisory |
Impacted products
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"id": "CVE-2018-11267",
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Vulnerability from fkie_nvd
Published
2018-09-20 13:29
Modified
2024-11-21 04:09
Severity ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests (for privacy reasons) is not done properly due to a flawed RNG which produces repeating output much earlier than expected.
References
Impacted products
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"value": "In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests (for privacy reasons) is not done properly due to a flawed RNG which produces repeating output much earlier than expected."
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"value": "En Snapdragon (Automobile, Mobile y Wear) en versiones MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710 y Snapdragon_High_Med_2016, la aleatorizaci\u00f3n de direcciones MAC realizada durante las peticiones probe (por razones de privacidad) no se realiz\u00f3 correctamente debido al uso de un RGN con errores, lo cual produc\u00eda salidas repetidas antes de lo esperado."
}
],
"id": "CVE-2018-5871",
"lastModified": "2024-11-21T04:09:35.340",
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"source": "product-security@qualcomm.com",
"tags": [
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"url": "https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components"
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"vulnStatus": "Modified",
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Vulnerability from fkie_nvd
Published
2018-09-20 13:29
Modified
2024-11-21 03:19
Severity ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ.
References
Impacted products
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"lastModified": "2024-11-21T03:19:50.143",
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"tags": [
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"vulnStatus": "Modified",
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}
Vulnerability from fkie_nvd
Published
2018-09-20 13:29
Modified
2024-11-21 03:43
Severity ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, while parsing FLAC file with corrupted picture block, a buffer over-read can occur.
References
Impacted products
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"value": "In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, while parsing FLAC file with corrupted picture block, a buffer over-read can occur."
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"value": "En Snapdragon (Automobile, Mobile y Wear) en versiones MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20 y Snapdragon_High_Med_2016, puede ocurrir una sobrelectura de b\u00fafer al analizar un archivo FLAC con un bloque de imagen corrupto."
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"id": "CVE-2018-11285",
"lastModified": "2024-11-21T03:43:03.447",
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"source": "product-security@qualcomm.com",
"tags": [
"Third Party Advisory"
],
"url": "https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components"
},
{
"source": "product-security@qualcomm.com",
"tags": [
"Vendor Advisory"
],
"url": "https://www.qualcomm.com/company/product-security/bulletins"
},
{
"source": "af854a3a-2127-422b-91ae-364da2661108",
"tags": [
"Third Party Advisory"
],
"url": "https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components"
},
{
"source": "af854a3a-2127-422b-91ae-364da2661108",
"tags": [
"Vendor Advisory"
],
"url": "https://www.qualcomm.com/company/product-security/bulletins"
}
],
"sourceIdentifier": "product-security@qualcomm.com",
"vulnStatus": "Modified",
"weaknesses": [
{
"description": [
{
"lang": "en",
"value": "CWE-125"
}
],
"source": "nvd@nist.gov",
"type": "Primary"
}
]
}
Vulnerability from fkie_nvd
Published
2018-09-20 13:29
Modified
2024-11-21 03:43
Severity ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, lack of input validation in WLANWMI command handlers can lead to integer & heap overflows.
References
Impacted products
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"value": "In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, lack of input validation in WLANWMI command handlers can lead to integer \u0026 heap overflows."
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"id": "CVE-2018-11292",
"lastModified": "2024-11-21T03:43:04.800",
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"references": [
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"weaknesses": [
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"value": "CWE-190"
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{
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Vulnerability from fkie_nvd
Published
2018-09-20 13:29
Modified
2024-11-21 03:44
Severity ?
Summary
In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure.
References
| ▼ | URL | Tags | |
|---|---|---|---|
| product-security@qualcomm.com | https://www.qualcomm.com/company/product-security/bulletins | Third Party Advisory | |
| af854a3a-2127-422b-91ae-364da2661108 | https://www.qualcomm.com/company/product-security/bulletins | Third Party Advisory |
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"value": "In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure."
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