cve-2018-11277
Vulnerability from cvelistv5
Published
2018-09-20 13:00
Modified
2024-08-05 08:01
Severity ?
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
Impacted products
Vendor Product Version
Show details on NVD website


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      "id": "CVE-2018-11277",
      "lastModified": "2024-11-21T03:43:02.667",
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      "published": "2018-09-20T13:29:01.167",
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https://www.qualcomm.com/company/product-security/bulletins\",\"source\":\"product-security@qualcomm.com\",\"tags\":[\"Vendor Advisory\"]},{\"url\":\"https://www.qualcomm.com/company/product-security/bulletins\",\"source\":\"af854a3a-2127-422b-91ae-364da2661108\",\"tags\":[\"Vendor Advisory\"]}]}}"
  }
}


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Sightings

Author Source Type Date

Nomenclature

  • Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
  • Confirmed: The vulnerability is confirmed from an analyst perspective.
  • Exploited: This vulnerability was exploited and seen by the user reporting the sighting.
  • Patched: This vulnerability was successfully patched by the user reporting the sighting.
  • Not exploited: This vulnerability was not exploited or seen by the user reporting the sighting.
  • Not confirmed: The user expresses doubt about the veracity of the vulnerability.
  • Not patched: This vulnerability was not successfully patched by the user reporting the sighting.