CVE-2017-18313 (GCVE-0-2017-18313)
Vulnerability from cvelistv5 – Published: 2018-10-23 13:00 – Updated: 2024-08-05 21:20
VLAI?
Summary
Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617.
Severity ?
No CVSS data available.
CWE
- Improper Access Control in WLAN
Assigner
References
| URL | Tags | |||||||
|---|---|---|---|---|---|---|---|---|
|
||||||||
Impacted products
| Vendor | Product | Version | ||
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Mobile, Snapdragon Wear |
Affected:
MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617
|
{
"containers": {
"adp": [
{
"providerMetadata": {
"dateUpdated": "2024-08-05T21:20:49.924Z",
"orgId": "af854a3a-2127-422b-91ae-364da2661108",
"shortName": "CVE"
},
"references": [
{
"tags": [
"x_refsource_CONFIRM",
"x_transferred"
],
"url": "https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components"
},
{
"tags": [
"x_refsource_CONFIRM",
"x_transferred"
],
"url": "https://www.qualcomm.com/company/product-security/bulletins"
}
],
"title": "CVE Program Container"
}
],
"cna": {
"affected": [
{
"product": "Snapdragon Mobile, Snapdragon Wear",
"vendor": "Qualcomm, Inc.",
"versions": [
{
"status": "affected",
"version": "MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617"
}
]
}
],
"datePublic": "2018-09-04T00:00:00",
"descriptions": [
{
"lang": "en",
"value": "Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617."
}
],
"problemTypes": [
{
"descriptions": [
{
"description": "Improper Access Control in WLAN",
"lang": "en",
"type": "text"
}
]
}
],
"providerMetadata": {
"dateUpdated": "2018-10-23T12:57:01",
"orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
"shortName": "qualcomm"
},
"references": [
{
"tags": [
"x_refsource_CONFIRM"
],
"url": "https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components"
},
{
"tags": [
"x_refsource_CONFIRM"
],
"url": "https://www.qualcomm.com/company/product-security/bulletins"
}
],
"x_legacyV4Record": {
"CVE_data_meta": {
"ASSIGNER": "product-security@qualcomm.com",
"ID": "CVE-2017-18313",
"STATE": "PUBLIC"
},
"affects": {
"vendor": {
"vendor_data": [
{
"product": {
"product_data": [
{
"product_name": "Snapdragon Mobile, Snapdragon Wear",
"version": {
"version_data": [
{
"version_value": "MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617"
}
]
}
}
]
},
"vendor_name": "Qualcomm, Inc."
}
]
}
},
"data_format": "MITRE",
"data_type": "CVE",
"data_version": "4.0",
"description": {
"description_data": [
{
"lang": "eng",
"value": "Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617."
}
]
},
"problemtype": {
"problemtype_data": [
{
"description": [
{
"lang": "eng",
"value": "Improper Access Control in WLAN"
}
]
}
]
},
"references": {
"reference_data": [
{
"name": "https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components",
"refsource": "CONFIRM",
"url": "https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components"
},
{
"name": "https://www.qualcomm.com/company/product-security/bulletins",
"refsource": "CONFIRM",
"url": "https://www.qualcomm.com/company/product-security/bulletins"
}
]
}
}
}
},
"cveMetadata": {
"assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
"assignerShortName": "qualcomm",
"cveId": "CVE-2017-18313",
"datePublished": "2018-10-23T13:00:00",
"dateReserved": "2018-06-15T00:00:00",
"dateUpdated": "2024-08-05T21:20:49.924Z",
"state": "PUBLISHED"
},
"dataType": "CVE_RECORD",
"dataVersion": "5.1",
"vulnerability-lookup:meta": {
"fkie_nvd": {
"configurations": "[{\"operator\": \"AND\", \"nodes\": [{\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": true, \"criteria\": \"cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"FE28A59C-7AA6-4B85-84E8-07852B96108E\"}]}, {\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": false, \"criteria\": \"cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"5DEE828B-09A7-4AC1-8134-491A7C87C118\"}]}]}, {\"operator\": \"AND\", \"nodes\": [{\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": true, \"criteria\": \"cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"0FA80D57-3191-47CF-AD3F-9F2D64E443FE\"}]}, {\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": false, \"criteria\": \"cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"B2AFB212-F01A-4CEB-8DB4-2E0CC2308CB6\"}]}]}, {\"operator\": \"AND\", \"nodes\": [{\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": true, \"criteria\": \"cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"E0986EF1-0974-488E-84C4-6880F876CE55\"}]}, {\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": false, \"criteria\": \"cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"8C08BA58-2EBC-4A22-85A4-2ECD54693B9B\"}]}]}, {\"operator\": \"AND\", \"nodes\": [{\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": true, \"criteria\": \"cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"27110478-4C08-49E6-BD53-8BAAD9D5BD65\"}]}, {\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": false, \"criteria\": \"cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"3664D302-D22A-4B25-B534-3097AE2F8573\"}]}]}, {\"operator\": \"AND\", \"nodes\": [{\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": true, \"criteria\": \"cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"F683C42D-A310-4369-9689-3DBC9288591E\"}]}, {\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": false, \"criteria\": \"cpe:2.3:h:qualcomm:sd_410:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"0EADE10A-0F63-4149-8F03-030673D6D7CE\"}]}]}, {\"operator\": \"AND\", \"nodes\": [{\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": true, \"criteria\": \"cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"A78C9449-5EB0-459B-AA72-EFF00592C30A\"}]}, {\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": false, \"criteria\": \"cpe:2.3:h:qualcomm:sd_412:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"2D583172-F1F1-4DF8-99CE-B94A84D14CCD\"}]}]}, {\"operator\": \"AND\", \"nodes\": [{\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": true, \"criteria\": \"cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"549E6F7E-A54F-423F-BD4A-A8FB97DBD39E\"}]}, {\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": false, \"criteria\": \"cpe:2.3:h:qualcomm:sd_615:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"992C3835-7183-4D96-8647-DD9916880323\"}]}]}, {\"operator\": \"AND\", \"nodes\": [{\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": true, \"criteria\": \"cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"A7B95CCC-37F1-4768-8D64-CA2028E93E03\"}]}, {\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": false, \"criteria\": \"cpe:2.3:h:qualcomm:sd_616:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"D1426161-4F7C-44B1-AA9E-EA661AA68947\"}]}]}, {\"operator\": \"AND\", \"nodes\": [{\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": true, \"criteria\": \"cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"ECF81213-DE2D-4C4B-99E8-71AFD87E92CD\"}]}, {\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": false, \"criteria\": \"cpe:2.3:h:qualcomm:sd_415:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"95E826EF-343B-47FA-AB54-F13E868CE6A7\"}]}]}, {\"operator\": \"AND\", \"nodes\": [{\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": true, \"criteria\": \"cpe:2.3:o:qualcomm:sd_617_firmware:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"D27A1760-8D1B-4172-B6CE-65C72332F103\"}]}, {\"operator\": \"OR\", \"negate\": false, \"cpeMatch\": [{\"vulnerable\": false, \"criteria\": \"cpe:2.3:h:qualcomm:sd_617:-:*:*:*:*:*:*:*\", \"matchCriteriaId\": \"CC5F96F1-D3FB-482B-A3C8-57BA4DE86D5E\"}]}]}]",
"descriptions": "[{\"lang\": \"en\", \"value\": \"Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617.\"}, {\"lang\": \"es\", \"value\": \"En ciertos modos de operaciones, HLOS podr\\u00eda ser capaz de obtener acceso directo o indirecto mediante los canales DXE para manipular el firmware WCNSS autenticado almacenado en DDR debido a que la memoria DXE accesible se ubica en la imagen autenticada en Snapdragon Mobile y Snapdragon Wear en versiones MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415 y SD 617.\"}]",
"id": "CVE-2017-18313",
"lastModified": "2024-11-21T03:19:50.010",
"metrics": "{\"cvssMetricV30\": [{\"source\": \"nvd@nist.gov\", \"type\": \"Primary\", \"cvssData\": {\"version\": \"3.0\", \"vectorString\": \"CVSS:3.0/AV:A/AC:H/PR:N/UI:N/S:U/C:N/I:H/A:N\", \"baseScore\": 5.3, \"baseSeverity\": \"MEDIUM\", \"attackVector\": \"ADJACENT_NETWORK\", \"attackComplexity\": \"HIGH\", \"privilegesRequired\": \"NONE\", \"userInteraction\": \"NONE\", \"scope\": \"UNCHANGED\", \"confidentialityImpact\": \"NONE\", \"integrityImpact\": \"HIGH\", \"availabilityImpact\": \"NONE\"}, \"exploitabilityScore\": 1.6, \"impactScore\": 3.6}], \"cvssMetricV2\": [{\"source\": \"nvd@nist.gov\", \"type\": \"Primary\", \"cvssData\": {\"version\": \"2.0\", \"vectorString\": \"AV:A/AC:M/Au:N/C:N/I:C/A:N\", \"baseScore\": 5.7, \"accessVector\": \"ADJACENT_NETWORK\", \"accessComplexity\": \"MEDIUM\", \"authentication\": \"NONE\", \"confidentialityImpact\": \"NONE\", \"integrityImpact\": \"COMPLETE\", \"availabilityImpact\": \"NONE\"}, \"baseSeverity\": \"MEDIUM\", \"exploitabilityScore\": 5.5, \"impactScore\": 6.9, \"acInsufInfo\": false, \"obtainAllPrivilege\": false, \"obtainUserPrivilege\": false, \"obtainOtherPrivilege\": false, \"userInteractionRequired\": false}]}",
"published": "2018-10-23T13:29:02.837",
"references": "[{\"url\": \"https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components\", \"source\": \"product-security@qualcomm.com\", \"tags\": [\"Third Party Advisory\"]}, {\"url\": \"https://www.qualcomm.com/company/product-security/bulletins\", \"source\": \"product-security@qualcomm.com\", \"tags\": [\"Vendor Advisory\"]}, {\"url\": \"https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components\", \"source\": \"af854a3a-2127-422b-91ae-364da2661108\", \"tags\": [\"Third Party Advisory\"]}, {\"url\": \"https://www.qualcomm.com/company/product-security/bulletins\", \"source\": \"af854a3a-2127-422b-91ae-364da2661108\", \"tags\": [\"Vendor Advisory\"]}]",
"sourceIdentifier": "product-security@qualcomm.com",
"vulnStatus": "Modified",
"weaknesses": "[{\"source\": \"nvd@nist.gov\", \"type\": \"Primary\", \"description\": [{\"lang\": \"en\", \"value\": \"NVD-CWE-noinfo\"}]}]"
},
"nvd": "{\"cve\":{\"id\":\"CVE-2017-18313\",\"sourceIdentifier\":\"product-security@qualcomm.com\",\"published\":\"2018-10-23T13:29:02.837\",\"lastModified\":\"2024-11-21T03:19:50.010\",\"vulnStatus\":\"Modified\",\"cveTags\":[],\"descriptions\":[{\"lang\":\"en\",\"value\":\"Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617.\"},{\"lang\":\"es\",\"value\":\"En ciertos modos de operaciones, HLOS podr\u00eda ser capaz de obtener acceso directo o indirecto mediante los canales DXE para manipular el firmware WCNSS autenticado almacenado en DDR debido a que la memoria DXE accesible se ubica en la imagen autenticada en Snapdragon Mobile y Snapdragon Wear en versiones MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415 y SD 617.\"}],\"metrics\":{\"cvssMetricV30\":[{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"cvssData\":{\"version\":\"3.0\",\"vectorString\":\"CVSS:3.0/AV:A/AC:H/PR:N/UI:N/S:U/C:N/I:H/A:N\",\"baseScore\":5.3,\"baseSeverity\":\"MEDIUM\",\"attackVector\":\"ADJACENT_NETWORK\",\"attackComplexity\":\"HIGH\",\"privilegesRequired\":\"NONE\",\"userInteraction\":\"NONE\",\"scope\":\"UNCHANGED\",\"confidentialityImpact\":\"NONE\",\"integrityImpact\":\"HIGH\",\"availabilityImpact\":\"NONE\"},\"exploitabilityScore\":1.6,\"impactScore\":3.6}],\"cvssMetricV2\":[{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"cvssData\":{\"version\":\"2.0\",\"vectorString\":\"AV:A/AC:M/Au:N/C:N/I:C/A:N\",\"baseScore\":5.7,\"accessVector\":\"ADJACENT_NETWORK\",\"accessComplexity\":\"MEDIUM\",\"authentication\":\"NONE\",\"confidentialityImpact\":\"NONE\",\"integrityImpact\":\"COMPLETE\",\"availabilityImpact\":\"NONE\"},\"baseSeverity\":\"MEDIUM\",\"exploitabilityScore\":5.5,\"impactScore\":6.9,\"acInsufInfo\":false,\"obtainAllPrivilege\":false,\"obtainUserPrivilege\":false,\"obtainOtherPrivilege\":false,\"userInteractionRequired\":false}]},\"weaknesses\":[{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"description\":[{\"lang\":\"en\",\"value\":\"NVD-CWE-noinfo\"}]}],\"configurations\":[{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"FE28A59C-7AA6-4B85-84E8-07852B96108E\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"5DEE828B-09A7-4AC1-8134-491A7C87C118\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"0FA80D57-3191-47CF-AD3F-9F2D64E443FE\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"B2AFB212-F01A-4CEB-8DB4-2E0CC2308CB6\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"E0986EF1-0974-488E-84C4-6880F876CE55\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"8C08BA58-2EBC-4A22-85A4-2ECD54693B9B\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"27110478-4C08-49E6-BD53-8BAAD9D5BD65\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"3664D302-D22A-4B25-B534-3097AE2F8573\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"F683C42D-A310-4369-9689-3DBC9288591E\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_410:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"0EADE10A-0F63-4149-8F03-030673D6D7CE\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"A78C9449-5EB0-459B-AA72-EFF00592C30A\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_412:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"2D583172-F1F1-4DF8-99CE-B94A84D14CCD\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"549E6F7E-A54F-423F-BD4A-A8FB97DBD39E\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_615:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"992C3835-7183-4D96-8647-DD9916880323\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"A7B95CCC-37F1-4768-8D64-CA2028E93E03\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_616:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"D1426161-4F7C-44B1-AA9E-EA661AA68947\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"ECF81213-DE2D-4C4B-99E8-71AFD87E92CD\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_415:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"95E826EF-343B-47FA-AB54-F13E868CE6A7\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_617_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"D27A1760-8D1B-4172-B6CE-65C72332F103\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_617:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"CC5F96F1-D3FB-482B-A3C8-57BA4DE86D5E\"}]}]}],\"references\":[{\"url\":\"https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components\",\"source\":\"product-security@qualcomm.com\",\"tags\":[\"Third Party Advisory\"]},{\"url\":\"https://www.qualcomm.com/company/product-security/bulletins\",\"source\":\"product-security@qualcomm.com\",\"tags\":[\"Vendor Advisory\"]},{\"url\":\"https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components\",\"source\":\"af854a3a-2127-422b-91ae-364da2661108\",\"tags\":[\"Third Party Advisory\"]},{\"url\":\"https://www.qualcomm.com/company/product-security/bulletins\",\"source\":\"af854a3a-2127-422b-91ae-364da2661108\",\"tags\":[\"Vendor Advisory\"]}]}}"
}
}
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Sightings
| Author | Source | Type | Date |
|---|
Nomenclature
- Seen: The vulnerability was mentioned, discussed, or observed by the user.
- Confirmed: The vulnerability has been validated from an analyst's perspective.
- Published Proof of Concept: A public proof of concept is available for this vulnerability.
- Exploited: The vulnerability was observed as exploited by the user who reported the sighting.
- Patched: The vulnerability was observed as successfully patched by the user who reported the sighting.
- Not exploited: The vulnerability was not observed as exploited by the user who reported the sighting.
- Not confirmed: The user expressed doubt about the validity of the vulnerability.
- Not patched: The vulnerability was not observed as successfully patched by the user who reported the sighting.
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