cve-2019-10569
Vulnerability from cvelistv5
Published
2020-03-05 08:56
Modified
2024-08-04 22:24
Severity ?
Summary
Stack buffer overflow due to instance id is misplaced inside definition of hardware accelerated effects in makefile in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile in APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130
References
product-security@qualcomm.comhttps://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletinPatch, Vendor Advisory
af854a3a-2127-422b-91ae-364da2661108https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletinPatch, Vendor Advisory
Impacted products
Vendor Product Version
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile Version: APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130
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         descriptions: "[{\"lang\": \"en\", \"value\": \"Stack buffer overflow due to instance id is misplaced inside definition of hardware accelerated effects in makefile in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile in APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130\"}, {\"lang\": \"es\", \"value\": \"Un desbordamiento del b\\u00fafer de la pila debido a que el id de la instancia est\\u00e1 colocado inapropiadamente dentro de la definici\\u00f3n de los efectos acelerados del hardware en makefile en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile en las versiones APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130.\"}]",
         id: "CVE-2019-10569",
         lastModified: "2024-11-21T04:19:28.580",
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         published: "2020-03-05T09:15:15.797",
         references: "[{\"url\": \"https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin\", \"source\": \"product-security@qualcomm.com\", \"tags\": [\"Patch\", \"Vendor Advisory\"]}, {\"url\": \"https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin\", \"source\": \"af854a3a-2127-422b-91ae-364da2661108\", \"tags\": [\"Patch\", \"Vendor Advisory\"]}]",
         sourceIdentifier: "product-security@qualcomm.com",
         vulnStatus: "Modified",
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      nvd: "{\"cve\":{\"id\":\"CVE-2019-10569\",\"sourceIdentifier\":\"product-security@qualcomm.com\",\"published\":\"2020-03-05T09:15:15.797\",\"lastModified\":\"2024-11-21T04:19:28.580\",\"vulnStatus\":\"Modified\",\"cveTags\":[],\"descriptions\":[{\"lang\":\"en\",\"value\":\"Stack buffer overflow due to instance id is misplaced inside definition of hardware accelerated effects in makefile in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile in APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130\"},{\"lang\":\"es\",\"value\":\"Un desbordamiento del búfer de la pila debido a que el id de la instancia está colocado inapropiadamente dentro de la definición de los efectos acelerados del hardware en makefile en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile en las versiones APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130.\"}],\"metrics\":{\"cvssMetricV31\":[{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"cvssData\":{\"version\":\"3.1\",\"vectorString\":\"CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H\",\"baseScore\":7.8,\"baseSeverity\":\"HIGH\",\"attackVector\":\"LOCAL\",\"attackComplexity\":\"LOW\",\"privilegesRequired\":\"LOW\",\"userInteraction\":\"NONE\",\"scope\":\"UNCHANGED\",\"confidentialityImpact\":\"HIGH\",\"integrityImpact\":\"HIGH\",\"availabilityImpact\":\"HIGH\"},\"exploitabilityScore\":1.8,\"impactScore\":5.9}],\"cvssMetricV2\":[{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"cvssData\":{\"version\":\"2.0\",\"vectorString\":\"AV:L/AC:L/Au:N/C:C/I:C/A:C\",\"baseScore\":7.2,\"accessVector\":\"LOCAL\",\"accessComplexity\":\"LOW\",\"authentication\":\"NONE\",\"confidentialityImpact\":\"COMPLETE\",\"integrityImpact\":\"COMPLETE\",\"availabilityImpact\":\"COMPLETE\"},\"baseSeverity\":\"HIGH\",\"exploitabilityScore\":3.9,\"impactScore\":10.0,\"acInsufInfo\":false,\"obtainAllPrivilege\":false,\"obtainUserPrivilege\":false,\"obtainOtherPrivilege\":false,\"userInteractionRequired\":false}]},\"weaknesses\":[{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"description\":[{\"lang\":\"en\",\"value\":\"CWE-787\"}]}],\"configurations\":[{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"B052615D-857A-46D4-9098-1CBFA14687C6\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:apq8053:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"19B59B60-A298-4A56-A45A-E34B7AAB43D7\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:apq8098_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"13A7328A-89FB-4E9C-B4E3-D8097443FB7A\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:apq8098:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"678A68E0-81D8-4562-826E-03872184256C\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"A35FECFB-60AE-42A8-BCBB-FEA7D5826D49\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"E9765187-8653-4D66-B230-B2CE862AC5C0\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"7FD1C359-C79B-4CE8-A192-5AA34D0BF05B\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:mdm9640:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"716B747E-672C-4B95-9D8E-1262338E67EA\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:msm8998_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"0E9154AF-E52E-4E84-9322-2CA7EBD3E6FE\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:msm8998:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"4796F9BD-61B3-45ED-B5E3-B061887285E2\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"B05FD66D-13A6-40E9-A64B-E428378F237E\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"D0D665C1-3EBA-42F2-BF56-55E6C365F7DF\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"30A45C1A-C921-42B5-9237-367245023B45\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sc8180x:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"56C9D979-F214-4CD4-8CF9-43BC804BB179\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"84289E6D-DA2A-4D04-9DDA-E8C46DDDD056\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sdm439:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"C0B56360-7AC3-410A-B7F8-1BE8514B3781\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"8EA0D645-80F6-48C3-AF0D-99198ADC8778\"}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Advisory\"]},{\"url\":\"https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin\",\"source\":\"af854a3a-2127-422b-91ae-364da2661108\",\"tags\":[\"Patch\",\"Vendor Advisory\"]}]}}",
   },
}


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