cve-2021-35130
Vulnerability from cvelistv5
Published
2022-06-14 10:11
Modified
2024-08-04 00:33
Severity ?
8.4 (High) - CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Summary
Memory corruption in graphics support layer due to use after free condition in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
References
product-security@qualcomm.comhttps://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletinPatch, Vendor Advisory
af854a3a-2127-422b-91ae-364da2661108https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletinPatch, Vendor Advisory
Impacted products
Vendor Product Version
Show details on NVD website

To clipboard 

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      "descriptions": "[{\"lang\": \"en\", \"value\": \"Memory corruption in graphics support layer due to use after free condition in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables\"}, {\"lang\": \"es\", \"value\": \"Una corrupci\\u00f3n de memoria en la capa de soporte de gr\\u00e1ficos debido a la condici\\u00f3n de uso despu\\u00e9s de libre en Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables\"}]",
      "id": "CVE-2021-35130",
      "lastModified": "2024-11-21T06:11:59.743",
      "metrics": "{\"cvssMetricV31\": [{\"source\": \"product-security@qualcomm.com\", \"type\": \"Secondary\", \"cvssData\": {\"version\": \"3.1\", \"vectorString\": \"CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H\", \"baseScore\": 8.4, \"baseSeverity\": \"HIGH\", \"attackVector\": \"LOCAL\", \"attackComplexity\": \"LOW\", \"privilegesRequired\": \"NONE\", \"userInteraction\": \"NONE\", \"scope\": \"UNCHANGED\", \"confidentialityImpact\": \"HIGH\", \"integrityImpact\": \"HIGH\", \"availabilityImpact\": \"HIGH\"}, \"exploitabilityScore\": 2.5, \"impactScore\": 5.9}, {\"source\": \"nvd@nist.gov\", \"type\": \"Primary\", \"cvssData\": {\"version\": \"3.1\", \"vectorString\": \"CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H\", \"baseScore\": 7.8, \"baseSeverity\": \"HIGH\", \"attackVector\": \"LOCAL\", \"attackComplexity\": \"LOW\", \"privilegesRequired\": \"LOW\", \"userInteraction\": \"NONE\", \"scope\": \"UNCHANGED\", \"confidentialityImpact\": \"HIGH\", \"integrityImpact\": \"HIGH\", \"availabilityImpact\": \"HIGH\"}, \"exploitabilityScore\": 1.8, \"impactScore\": 5.9}], \"cvssMetricV2\": [{\"source\": \"nvd@nist.gov\", \"type\": \"Primary\", \"cvssData\": {\"version\": \"2.0\", \"vectorString\": \"AV:L/AC:L/Au:N/C:C/I:C/A:C\", \"baseScore\": 7.2, \"accessVector\": \"LOCAL\", \"accessComplexity\": \"LOW\", \"authentication\": \"NONE\", \"confidentialityImpact\": \"COMPLETE\", \"integrityImpact\": \"COMPLETE\", \"availabilityImpact\": \"COMPLETE\"}, \"baseSeverity\": \"HIGH\", \"exploitabilityScore\": 3.9, \"impactScore\": 10.0, \"acInsufInfo\": false, \"obtainAllPrivilege\": false, \"obtainUserPrivilege\": false, \"obtainOtherPrivilege\": false, \"userInteractionRequired\": false}]}",
      "published": "2022-06-14T10:15:17.687",
      "references": "[{\"url\": \"https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin\", \"source\": \"product-security@qualcomm.com\", \"tags\": [\"Patch\", \"Vendor Advisory\"]}, {\"url\": \"https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin\", \"source\": \"af854a3a-2127-422b-91ae-364da2661108\", \"tags\": [\"Patch\", \"Vendor Advisory\"]}]",
      "sourceIdentifier": "product-security@qualcomm.com",
      "vulnStatus": "Modified",
      "weaknesses": "[{\"source\": \"nvd@nist.gov\", \"type\": \"Primary\", \"description\": [{\"lang\": \"en\", \"value\": \"CWE-416\"}]}]"
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  }
}


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  • Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
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