cve-2023-28561
Vulnerability from cvelistv5
Published
2023-08-08 09:15
Modified
2024-08-02 13:43
Severity ?
EPSS score ?
Summary
Buffer Copy Without Checking Size of Input in QESL
References
Impacted products
▼ | Vendor | Product |
---|---|---|
Qualcomm, Inc. | Snapdragon |
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"https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin" } ], "title": "CVE Program Container" } ], "cna": { "affected": [ { "defaultStatus": "unaffected", "platforms": [ "Snapdragon Industrial IOT" ], "product": "Snapdragon", "vendor": "Qualcomm, Inc.", "versions": [ { "status": "affected", "version": "QCN7606" } ] } ], "descriptions": [ { "lang": "en", "value": "Memory corruption in QESL while processing payload from external ESL device to firmware." } ], "metrics": [ { "cvssV3_1": { "attackComplexity": "LOW", "attackVector": "NETWORK", "availabilityImpact": "HIGH", "baseScore": 9.8, "baseSeverity": "CRITICAL", "confidentialityImpact": "HIGH", "integrityImpact": "HIGH", "privilegesRequired": "NONE", "scope": "UNCHANGED", "userInteraction": "NONE", "vectorString": "CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H", "version": "3.1" }, "format": "CVSS", "scenarios": [ { "lang": "en", "value": "GENERAL" } ] } ], "problemTypes": [ { "descriptions": [ { "cweId": "CWE-120", "description": "CWE-120 Buffer Copy Without Checking Size of Input (\u0027Classic Buffer Overflow\u0027)", "lang": "en", "type": "CWE" } ] } ], "providerMetadata": { "dateUpdated": "2024-04-12T16:24:08.972Z", "orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f", "shortName": "qualcomm" }, "references": [ { "url": "https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin" } ], "title": "Buffer Copy Without Checking Size of Input in QESL" } }, "cveMetadata": { "assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f", "assignerShortName": "qualcomm", "cveId": "CVE-2023-28561", "datePublished": "2023-08-08T09:15:03.741Z", "dateReserved": "2023-03-17T11:41:45.848Z", "dateUpdated": "2024-08-02T13:43:23.590Z", "state": "PUBLISHED" }, "dataType": "CVE_RECORD", "dataVersion": "5.1", "meta": { "nvd": "{\"cve\":{\"id\":\"CVE-2023-28561\",\"sourceIdentifier\":\"product-security@qualcomm.com\",\"published\":\"2023-08-08T10:15:14.447\",\"lastModified\":\"2024-04-12T17:17:06.900\",\"vulnStatus\":\"Modified\",\"descriptions\":[{\"lang\":\"en\",\"value\":\"Memory corruption in QESL while processing payload from external ESL device to firmware.\"},{\"lang\":\"es\",\"value\":\"Corrupci\u00f3n de memoria en QESL al procesar la carga \u00fatil del dispositivo ESL externo al firmware.\"}],\"metrics\":{\"cvssMetricV31\":[{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"cvssData\":{\"version\":\"3.1\",\"vectorString\":\"CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H\",\"attackVector\":\"NETWORK\",\"attackComplexity\":\"LOW\",\"privilegesRequired\":\"NONE\",\"userInteraction\":\"NONE\",\"scope\":\"UNCHANGED\",\"confidentialityImpact\":\"HIGH\",\"integrityImpact\":\"HIGH\",\"availabilityImpact\":\"HIGH\",\"baseScore\":9.8,\"baseSeverity\":\"CRITICAL\"},\"exploitabilityScore\":3.9,\"impactScore\":5.9},{\"source\":\"product-security@qualcomm.com\",\"type\":\"Secondary\",\"cvssData\":{\"version\":\"3.1\",\"vectorString\":\"CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H\",\"attackVector\":\"NETWORK\",\"attackComplexity\":\"LOW\",\"privilegesRequired\":\"NONE\",\"userInteraction\":\"NONE\",\"scope\":\"UNCHANGED\",\"confidentialityImpact\":\"HIGH\",\"integrityImpact\":\"HIGH\",\"availabilityImpact\":\"HIGH\",\"baseScore\":9.8,\"baseSeverity\":\"CRITICAL\"},\"exploitabilityScore\":3.9,\"impactScore\":5.9}]},\"weaknesses\":[{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"description\":[{\"lang\":\"en\",\"value\":\"CWE-787\"}]},{\"source\":\"product-security@qualcomm.com\",\"type\":\"Secondary\",\"description\":[{\"lang\":\"en\",\"value\":\"CWE-120\"}]}],\"configurations\":[{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:qcn7606_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"F466A5BD-1912-4811-9A93-81555F101D46\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:qcn7606:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"0F92914E-16F6-4A25-9FEF-FB7CB3377132\"}]}]}],\"references\":[{\"url\":\"https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin\",\"source\":\"product-security@qualcomm.com\",\"tags\":[\"Vendor Advisory\"]}]}}" } }
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Sightings
Author | Source | Type | Date |
---|
Nomenclature
- Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
- Confirmed: The vulnerability is confirmed from an analyst perspective.
- Exploited: This vulnerability was exploited and seen by the user reporting the sighting.
- Patched: This vulnerability was successfully patched by the user reporting the sighting.
- Not exploited: This vulnerability was not exploited or seen by the user reporting the sighting.
- Not confirmed: The user expresses doubt about the veracity of the vulnerability.
- Not patched: This vulnerability was not successfully patched by the user reporting the sighting.