FKIE_CVE-2017-18173

Vulnerability from fkie_nvd - Published: 2019-05-06 23:29 - Updated: 2024-11-21 03:19
Severity ?
7.8 (High) - CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Summary
In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
References
product-security@qualcomm.comhttps://www.qualcomm.com/company/product-security/bulletinsVendor Advisory
af854a3a-2127-422b-91ae-364da2661108https://www.qualcomm.com/company/product-security/bulletinsVendor Advisory
Impacted products
Vendor Product Version
qualcomm sd_425_firmware -
qualcomm sd_425 -
qualcomm sd_427_firmware -
qualcomm sd_427 -
qualcomm sd_430_firmware -
qualcomm sd_430 -
qualcomm sd_435_firmware -
qualcomm sd_435 -
qualcomm sd_450_firmware -
qualcomm sd_450 -
qualcomm sd_625_firmware -
qualcomm sd_625 -
qualcomm sd_810_firmware -
qualcomm sd_810 -
qualcomm sd_820_firmware -
qualcomm sd_820 -
qualcomm sd_835_firmware -
qualcomm sd_835 -
qualcomm sdm630_firmware -
qualcomm sdm630 -
qualcomm sdm636_firmware -
qualcomm sdm636 -
qualcomm sdm660_firmware -
qualcomm sdm660 -
qualcomm snapdragon_high_med_2016_firmware -
qualcomm snapdragon_high_med_2016 -
To clipboard 

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  "id": "CVE-2017-18173",
  "lastModified": "2024-11-21T03:19:28.997",
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  "published": "2019-05-06T23:29:00.487",
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  • Confirmed: The vulnerability has been validated from an analyst's perspective.
  • Published Proof of Concept: A public proof of concept is available for this vulnerability.
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  • Not patched: The vulnerability was not observed as successfully patched by the user who reported the sighting.



Detection rules are retrieved from Rulezet.