FKIE_CVE-2020-11156

Vulnerability from fkie_nvd - Published: 2020-11-02 07:15 - Updated: 2024-11-21 04:56
Severity ?
8.1 (High) - CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:H
Summary
u'Buffer over-read issue in Bluetooth estack due to lack of check for invalid length of L2cap packet received from peer device.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in QCA6390, QCN7605, QCS404, SA415M, SA515M, SC8180X, SDX55, SM8250
References
product-security@qualcomm.comhttps://www.qualcomm.com/company/product-security/bulletins/october-2020-bulletinBroken Link
nvd@nist.govhttps://www.qualcomm.com/company/product-security/bulletins/october-2020-security-bulletinVendor Advisory
af854a3a-2127-422b-91ae-364da2661108https://www.qualcomm.com/company/product-security/bulletins/october-2020-bulletinBroken Link
Impacted products
Vendor Product Version
qualcomm qca6390_firmware -
qualcomm qca6390 -
qualcomm qcn7605_firmware -
qualcomm qcn7605 -
qualcomm qcs404_firmware -
qualcomm qcs404 -
qualcomm sa415m_firmware -
qualcomm sa415m -
qualcomm sa515m_firmware -
qualcomm sa515m -
qualcomm sc8180x_firmware -
qualcomm sc8180x -
qualcomm sdx55_firmware -
qualcomm sdx55 -
qualcomm sm8250_firmware -
qualcomm sm8250 -
To clipboard 

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  • Seen: The vulnerability was mentioned, discussed, or observed by the user.
  • Confirmed: The vulnerability has been validated from an analyst's perspective.
  • Published Proof of Concept: A public proof of concept is available for this vulnerability.
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