FKIE_CVE-2022-33217

Vulnerability from fkie_nvd - Published: 2022-10-19 11:15 - Updated: 2026-06-17 04:48
Severity
7.8 (High) - CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
7.8 (High) - CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Summary
Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. in Snapdragon Mobile
References
product-security@qualcomm.comhttps://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletinVendor Advisory
af854a3a-2127-422b-91ae-364da2661108https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletinVendor Advisory
Impacted products
Vendor Product Version
qualcomm sd_8_gen1_5g_firmware -
qualcomm sm8475 -
qualcomm wcd9380_firmware -
qualcomm wcd9380 -
qualcomm wcn6855_firmware -
qualcomm wcn6855 -
qualcomm wcn6856_firmware -
qualcomm wcn6856 -
qualcomm wcn7850_firmware -
qualcomm wcn7850 -
qualcomm wcn7851_firmware -
qualcomm wcn7851 -
qualcomm wsa8830_firmware -
qualcomm wsa8830 -
qualcomm wsa8835_firmware -
qualcomm wsa8835 -
To clipboard 

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          "product": "Snapdragon Mobile",
          "vendor": "Qualcomm, Inc.",
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  "cveTags": [],
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      "lang": "en",
      "value": "Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. in Snapdragon Mobile"
    },
    {
      "lang": "es",
      "value": "Una corrupci\u00f3n de memoria en Qualcomm IPC debido a una copia del b\u00fafer sin comprobar el tama\u00f1o de la entrada mientras es iniciada la comunicaci\u00f3n con un kernel comprometido. en Snapdragon Mobile"
    }
  ],
  "id": "CVE-2022-33217",
  "lastModified": "2026-06-17T04:48:39.457",
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}



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