github - ghsa-85fp-hp45-wj39

ghsa-85fp-hp45-wj39

Vulnerability from github

Published

2022-01-14 00:02

Modified

2023-04-19 18:30

Severity ?

7.8 (High) - CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Details

Possible buffer overflow while printing the HARQ memory partition detail due to improper validation of buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile

Show details on source website

JSON

To clipboard

{
  "affected": [],
  "aliases": [
    "CVE-2021-30308"
  ],
  "database_specific": {
    "cwe_ids": [
      "CWE-120"
    ],
    "github_reviewed": false,
    "github_reviewed_at": null,
    "nvd_published_at": "2022-01-13T12:15:00Z",
    "severity": "HIGH"
  },
  "details": "Possible buffer overflow while printing the HARQ memory partition detail due to improper validation of buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile",
  "id": "GHSA-85fp-hp45-wj39",
  "modified": "2023-04-19T18:30:54Z",
  "published": "2022-01-14T00:02:23Z",
  "references": [
    {
      "type": "ADVISORY",
      "url": "https://nvd.nist.gov/vuln/detail/CVE-2021-30308"
    },
    {
      "type": "WEB",
      "url": "https://www.qualcomm.com/company/product-security/bulletins/january-2022-bulletin"
    }
  ],
  "schema_version": "1.4.0",
  "severity": [
    {
      "score": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
      "type": "CVSS_V3"
    }
  ]
}

cve-2021-30308

Vulnerability from cvelistv5

Published

2022-01-13 11:40

Modified

2024-08-03 22:32

Severity ?

7.8 (High) - CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Summary

References

▼	URL	Tags
	https://www.qualcomm.com/company/product-security/bulletins/january-2022-bulletin	x_refsource_CONFIRM

Impacted products

▼	Vendor	Product
	Qualcomm, Inc.	Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile

Show details on NVD website

JSON

To clipboard

{
  "containers": {
    "adp": [
      {
        "providerMetadata": {
          "dateUpdated": "2024-08-03T22:32:40.433Z",
          "orgId": "af854a3a-2127-422b-91ae-364da2661108",
          "shortName": "CVE"
        },
        "references": [
          {
            "tags": [
              "x_refsource_CONFIRM",
              "x_transferred"
            ],
            "url": "https://www.qualcomm.com/company/product-security/bulletins/january-2022-bulletin"
          }
        ],
        "title": "CVE Program Container"
      }
    ],
    "cna": {
      "affected": [
        {
          "product": "Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile",
          "vendor": "Qualcomm, Inc.",
          "versions": [
            {
              "status": "affected",
              "version": "AQT1000, AR8035, CSRB31024, FSM10056, MDM9150, MDM9250, MDM9650, QCA6174A, QCA6390, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6564A, QCA6564AU, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, QCS410, QCS603, QCS605, QCS610, QCX315, SA415M, SA515M, SD 675, SD 8 Gen1 5G, SD 8cx Gen2, SD480, SD660, SD665, SD675, SD678, SD690 5G, SD720G, SD730, SD750G, SD765, SD765G, SD768G, SD7c, SD845, SD850, SD855, SD865 5G, SD870, SDX12, SDX20, SDX24, SDX55, SDX55M, SDX65, SDXR1, SDXR2 5G, SM6250, SM6250P, SM6375, SM7250P, WCD9326, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9375, WCD9380, WCD9385, WCN3950, WCN3980, WCN3988, WCN3990, WCN3991, WCN3998, WCN6850, WCN6851, WCN6855, WCN6856, WSA8810, WSA8815, WSA8830, WSA8835"
            }
          ]
        }
      ],
      "descriptions": [
        {
          "lang": "en",
          "value": "Possible buffer overflow while printing the HARQ memory partition detail due to improper validation of buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile"
        }
      ],
      "metrics": [
        {
          "cvssV3_1": {
            "attackComplexity": "LOW",
            "attackVector": "LOCAL",
            "availabilityImpact": "HIGH",
            "baseScore": 7.8,
            "baseSeverity": "HIGH",
            "confidentialityImpact": "HIGH",
            "integrityImpact": "HIGH",
            "privilegesRequired": "LOW",
            "scope": "UNCHANGED",
            "userInteraction": "NONE",
            "vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
            "version": "3.1"
          }
        }
      ],
      "problemTypes": [
        {
          "descriptions": [
            {
              "description": "Buffer Copy Without Checking Size of Input in Modem",
              "lang": "en",
              "type": "text"
            }
          ]
        }
      ],
      "providerMetadata": {
        "dateUpdated": "2022-01-13T11:40:27",
        "orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
        "shortName": "qualcomm"
      },
      "references": [
        {
          "tags": [
            "x_refsource_CONFIRM"
          ],
          "url": "https://www.qualcomm.com/company/product-security/bulletins/january-2022-bulletin"
        }
      ],
      "x_legacyV4Record": {
        "CVE_data_meta": {
          "ASSIGNER": "product-security@qualcomm.com",
          "ID": "CVE-2021-30308",
          "STATE": "PUBLIC"
        },
        "affects": {
          "vendor": {
            "vendor_data": [
              {
                "product": {
                  "product_data": [
                    {
                      "product_name": "Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile",
                      "version": {
                        "version_data": [
                          {
                            "version_value": "AQT1000, AR8035, CSRB31024, FSM10056, MDM9150, MDM9250, MDM9650, QCA6174A, QCA6390, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6564A, QCA6564AU, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, QCS410, QCS603, QCS605, QCS610, QCX315, SA415M, SA515M, SD 675, SD 8 Gen1 5G, SD 8cx Gen2, SD480, SD660, SD665, SD675, SD678, SD690 5G, SD720G, SD730, SD750G, SD765, SD765G, SD768G, SD7c, SD845, SD850, SD855, SD865 5G, SD870, SDX12, SDX20, SDX24, SDX55, SDX55M, SDX65, SDXR1, SDXR2 5G, SM6250, SM6250P, SM6375, SM7250P, WCD9326, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9375, WCD9380, WCD9385, WCN3950, WCN3980, WCN3988, WCN3990, WCN3991, WCN3998, WCN6850, WCN6851, WCN6855, WCN6856, WSA8810, WSA8815, WSA8830, WSA8835"
                          }
                        ]
                      }
                    }
                  ]
                },
                "vendor_name": "Qualcomm, Inc."
              }
            ]
          }
        },
        "data_format": "MITRE",
        "data_type": "CVE",
        "data_version": "4.0",
        "description": {
          "description_data": [
            {
              "lang": "eng",
              "value": "Possible buffer overflow while printing the HARQ memory partition detail due to improper validation of buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile"
            }
          ]
        },
        "impact": {
          "cvss": {
            "baseScore": 7.8,
            "vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
            "version": "3.1"
          }
        },
        "problemtype": {
          "problemtype_data": [
            {
              "description": [
                {
                  "lang": "eng",
                  "value": "Buffer Copy Without Checking Size of Input in Modem"
                }
              ]
            }
          ]
        },
        "references": {
          "reference_data": [
            {
              "name": "https://www.qualcomm.com/company/product-security/bulletins/january-2022-bulletin",
              "refsource": "CONFIRM",
              "url": "https://www.qualcomm.com/company/product-security/bulletins/january-2022-bulletin"
            }
          ]
        }
      }
    }
  },
  "cveMetadata": {
    "assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
    "assignerShortName": "qualcomm",
    "cveId": "CVE-2021-30308",
    "datePublished": "2022-01-13T11:40:27",
    "dateReserved": "2021-04-07T00:00:00",
    "dateUpdated": "2024-08-03T22:32:40.433Z",
    "state": "PUBLISHED"
  },
  "dataType": "CVE_RECORD",
  "dataVersion": "5.1"
}

Sightings

Author	Source	Type	Date

Nomenclature

Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
Confirmed: The vulnerability is confirmed from an analyst perspective.
Exploited: This vulnerability was exploited and seen by the user reporting the sighting.
Patched: This vulnerability was successfully patched by the user reporting the sighting.
Not exploited: This vulnerability was not exploited or seen by the user reporting the sighting.
Not confirmed: The user expresses doubt about the veracity of the vulnerability.
Not patched: This vulnerability was not successfully patched by the user reporting the sighting.

Action not permitted