ghsa-r278-qc2p-hfwp
Vulnerability from github
Published
2022-05-24 19:01
Modified
2022-05-24 19:01
Details
Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
{ "affected": [], "aliases": [ "CVE-2020-11279" ], "database_specific": { "cwe_ids": [ "CWE-190" ], "github_reviewed": false, "github_reviewed_at": null, "nvd_published_at": "2021-05-07T09:15:00Z", "severity": "CRITICAL" }, "details": "Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice \u0026 Music, Snapdragon Wearables", "id": "GHSA-r278-qc2p-hfwp", "modified": "2022-05-24T19:01:49Z", "published": "2022-05-24T19:01:49Z", "references": [ { "type": "ADVISORY", "url": "https://nvd.nist.gov/vuln/detail/CVE-2020-11279" }, { "type": "WEB", "url": "https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin" } ], "schema_version": "1.4.0", "severity": [] }
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