github - ghsa-vvm8-37ch-xp6p

ghsa-vvm8-37ch-xp6p

Vulnerability from github

Published

2022-05-24 17:27

Modified

2022-05-24 17:27

Details

u'Lack of check for integer overflow for round up and addition operations result into memory corruption and potential information leakage' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130

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{
  "affected": [],
  "aliases": [
    "CVE-2019-13999"
  ],
  "database_specific": {
    "cwe_ids": [
      "CWE-190"
    ],
    "github_reviewed": false,
    "github_reviewed_at": null,
    "nvd_published_at": "2020-09-08T10:15:00Z",
    "severity": "HIGH"
  },
  "details": "u\u0027Lack of check for integer overflow for round up and addition operations result into memory corruption and potential information leakage\u0027 in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice \u0026 Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130",
  "id": "GHSA-vvm8-37ch-xp6p",
  "modified": "2022-05-24T17:27:30Z",
  "published": "2022-05-24T17:27:30Z",
  "references": [
    {
      "type": "ADVISORY",
      "url": "https://nvd.nist.gov/vuln/detail/CVE-2019-13999"
    },
    {
      "type": "WEB",
      "url": "https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin"
    },
    {
      "type": "WEB",
      "url": "https://www.qualcomm.com/company/product-security/bulletins/august-2020-security-bulletin"
    }
  ],
  "schema_version": "1.4.0",
  "severity": []
}

cve-2019-13999

Vulnerability from cvelistv5

Published

2020-09-08 09:31

Modified

2024-08-05 00:05

Severity ?

Summary

References

▼	URL	Tags
	https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin	x_refsource_CONFIRM

Impacted products

▼	Vendor	Product
	Qualcomm, Inc.	Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking

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{
  "containers": {
    "adp": [
      {
        "providerMetadata": {
          "dateUpdated": "2024-08-05T00:05:44.146Z",
          "orgId": "af854a3a-2127-422b-91ae-364da2661108",
          "shortName": "CVE"
        },
        "references": [
          {
            "tags": [
              "x_refsource_CONFIRM",
              "x_transferred"
            ],
            "url": "https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin"
          }
        ],
        "title": "CVE Program Container"
      }
    ],
    "cna": {
      "affected": [
        {
          "product": "Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice \u0026 Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking",
          "vendor": "Qualcomm, Inc.",
          "versions": [
            {
              "status": "affected",
              "version": "APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130"
            }
          ]
        }
      ],
      "descriptions": [
        {
          "lang": "en",
          "value": "u\u0027Lack of check for integer overflow for round up and addition operations result into memory corruption and potential information leakage\u0027 in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice \u0026 Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130"
        }
      ],
      "problemTypes": [
        {
          "descriptions": [
            {
              "description": "Integer Overflow or Wraparound in Qualcomm IPC",
              "lang": "en",
              "type": "text"
            }
          ]
        }
      ],
      "providerMetadata": {
        "dateUpdated": "2020-09-08T09:31:29",
        "orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
        "shortName": "qualcomm"
      },
      "references": [
        {
          "tags": [
            "x_refsource_CONFIRM"
          ],
          "url": "https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin"
        }
      ],
      "x_legacyV4Record": {
        "CVE_data_meta": {
          "ASSIGNER": "product-security@qualcomm.com",
          "ID": "CVE-2019-13999",
          "STATE": "PUBLIC"
        },
        "affects": {
          "vendor": {
            "vendor_data": [
              {
                "product": {
                  "product_data": [
                    {
                      "product_name": "Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice \u0026 Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking",
                      "version": {
                        "version_data": [
                          {
                            "version_value": "APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130"
                          }
                        ]
                      }
                    }
                  ]
                },
                "vendor_name": "Qualcomm, Inc."
              }
            ]
          }
        },
        "data_format": "MITRE",
        "data_type": "CVE",
        "data_version": "4.0",
        "description": {
          "description_data": [
            {
              "lang": "eng",
              "value": "u\u0027Lack of check for integer overflow for round up and addition operations result into memory corruption and potential information leakage\u0027 in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice \u0026 Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130"
            }
          ]
        },
        "problemtype": {
          "problemtype_data": [
            {
              "description": [
                {
                  "lang": "eng",
                  "value": "Integer Overflow or Wraparound in Qualcomm IPC"
                }
              ]
            }
          ]
        },
        "references": {
          "reference_data": [
            {
              "name": "https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin",
              "refsource": "CONFIRM",
              "url": "https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin"
            }
          ]
        }
      }
    }
  },
  "cveMetadata": {
    "assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
    "assignerShortName": "qualcomm",
    "cveId": "CVE-2019-13999",
    "datePublished": "2020-09-08T09:31:29",
    "dateReserved": "2019-07-19T00:00:00",
    "dateUpdated": "2024-08-05T00:05:44.146Z",
    "state": "PUBLISHED"
  },
  "dataType": "CVE_RECORD",
  "dataVersion": "5.1"
}

Sightings

Author	Source	Type	Date

Nomenclature

Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
Confirmed: The vulnerability is confirmed from an analyst perspective.
Exploited: This vulnerability was exploited and seen by the user reporting the sighting.
Patched: This vulnerability was successfully patched by the user reporting the sighting.
Not exploited: This vulnerability was not exploited or seen by the user reporting the sighting.
Not confirmed: The user expresses doubt about the veracity of the vulnerability.
Not patched: This vulnerability was not successfully patched by the user reporting the sighting.

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