var-201906-0742
Vulnerability from variot
Out-of-Bounds access in TZ due to invalid index calculated to check against DDR in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in IPQ8074, MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCA8081, Qualcomm 215, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 650/52, SD 820, SD 820A, SDM439, Snapdragon_High_Med_2016. plural Snapdragon The product contains an out-of-bounds vulnerability.Information is obtained, information is altered, and service operation is disrupted (DoS) There is a possibility of being put into a state. Qualcomm Closed-Source Components are prone to the following security vulnerabilities: 1. Multiple buffer-overflow vulnerabilities 2. Multiple information disclosure vulnerabilities 3. Multiple out-of-bounds memory access vulnerabilities 4. An unauthorized-access vulnerability 5. Multiple denial-of-service vulnerabilities 6. An insecure-file-permissions vulnerability An attacker can exploit these issues to execute arbitrary code, perform unauthorized actions, cause denial-of-service condition and obtain sensitive information. This may aid in further attacks. These issues are being tracked by Android Bug IDs A-114074547,A-119050181,A-122474428,A-114067283,A-119049466,A-119050073,A-119049388,A-119050001,A-119049623,A-119051002,A-119050182,A-119052037,A-122472140,A-112303441 and A-123997497. Qualcomm MDM9206 is a central processing unit (CPU) product of Qualcomm (Qualcomm). A buffer error vulnerability exists in several Qualcomm products. This vulnerability stems from the incorrect verification of data boundaries when the network system or product performs operations on the memory, resulting in incorrect read and write operations to other associated memory locations. Attackers can exploit this vulnerability to cause buffer overflow or heap overflow, etc. The following products and versions are affected: Qualcomm IPQ8074; MDM9206; MDM9607; MDM9650; MDM9655; MSM8996AU; QCA8081; Qualcomm 215; SD 625; SD 632; SD 650/52; SD 820; SD 820A; SDM439; Snapdragon_High_Med_2016
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Sightings
| Author | Source | Type | Date |
|---|
Nomenclature
- Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
- Confirmed: The vulnerability is confirmed from an analyst perspective.
- Exploited: This vulnerability was exploited and seen by the user reporting the sighting.
- Patched: This vulnerability was successfully patched by the user reporting the sighting.
- Not exploited: This vulnerability was not exploited or seen by the user reporting the sighting.
- Not confirmed: The user expresses doubt about the veracity of the vulnerability.
- Not patched: This vulnerability was not successfully patched by the user reporting the sighting.