cve-2018-11862
Vulnerability from cvelistv5
Published
2018-10-29 18:00
Modified
2024-08-05 08:24
Severity ?
EPSS score ?
Summary
Buffer overflow can happen in WLAN module due to lack of validation of the input length in Snapdragon Mobile in version SD 845, SD 850, SDA660.
References
| ▼ | URL | Tags | |
|---|---|---|---|
| product-security@qualcomm.com | http://www.securityfocus.com/bid/107681 | Third Party Advisory, VDB Entry | |
| product-security@qualcomm.com | https://www.qualcomm.com/company/product-security/bulletins | Vendor Advisory |
Impacted products
| ▼ | Vendor | Product |
|---|---|---|
| Qualcomm, Inc. | Snapdragon Mobile |
{
"containers": {
"adp": [
{
"providerMetadata": {
"dateUpdated": "2024-08-05T08:24:02.247Z",
"orgId": "af854a3a-2127-422b-91ae-364da2661108",
"shortName": "CVE"
},
"references": [
{
"tags": [
"x_refsource_CONFIRM",
"x_transferred"
],
"url": "https://www.qualcomm.com/company/product-security/bulletins"
},
{
"name": "107681",
"tags": [
"vdb-entry",
"x_refsource_BID",
"x_transferred"
],
"url": "http://www.securityfocus.com/bid/107681"
}
],
"title": "CVE Program Container"
}
],
"cna": {
"affected": [
{
"product": "Snapdragon Mobile",
"vendor": "Qualcomm, Inc.",
"versions": [
{
"status": "affected",
"version": "SD 845, SD 850, SDA660"
}
]
}
],
"datePublic": "2018-10-29T00:00:00",
"descriptions": [
{
"lang": "en",
"value": "Buffer overflow can happen in WLAN module due to lack of validation of the input length in Snapdragon Mobile in version SD 845, SD 850, SDA660."
}
],
"problemTypes": [
{
"descriptions": [
{
"description": "Buffer Copy Without Checking Size of Input in WLAN",
"lang": "en",
"type": "text"
}
]
}
],
"providerMetadata": {
"dateUpdated": "2019-04-03T10:06:07",
"orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
"shortName": "qualcomm"
},
"references": [
{
"tags": [
"x_refsource_CONFIRM"
],
"url": "https://www.qualcomm.com/company/product-security/bulletins"
},
{
"name": "107681",
"tags": [
"vdb-entry",
"x_refsource_BID"
],
"url": "http://www.securityfocus.com/bid/107681"
}
],
"x_legacyV4Record": {
"CVE_data_meta": {
"ASSIGNER": "product-security@qualcomm.com",
"ID": "CVE-2018-11862",
"STATE": "PUBLIC"
},
"affects": {
"vendor": {
"vendor_data": [
{
"product": {
"product_data": [
{
"product_name": "Snapdragon Mobile",
"version": {
"version_data": [
{
"version_value": "SD 845, SD 850, SDA660"
}
]
}
}
]
},
"vendor_name": "Qualcomm, Inc."
}
]
}
},
"data_format": "MITRE",
"data_type": "CVE",
"data_version": "4.0",
"description": {
"description_data": [
{
"lang": "eng",
"value": "Buffer overflow can happen in WLAN module due to lack of validation of the input length in Snapdragon Mobile in version SD 845, SD 850, SDA660."
}
]
},
"problemtype": {
"problemtype_data": [
{
"description": [
{
"lang": "eng",
"value": "Buffer Copy Without Checking Size of Input in WLAN"
}
]
}
]
},
"references": {
"reference_data": [
{
"name": "https://www.qualcomm.com/company/product-security/bulletins",
"refsource": "CONFIRM",
"url": "https://www.qualcomm.com/company/product-security/bulletins"
},
{
"name": "107681",
"refsource": "BID",
"url": "http://www.securityfocus.com/bid/107681"
}
]
}
}
}
},
"cveMetadata": {
"assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
"assignerShortName": "qualcomm",
"cveId": "CVE-2018-11862",
"datePublished": "2018-10-29T18:00:00",
"dateReserved": "2018-06-07T00:00:00",
"dateUpdated": "2024-08-05T08:24:02.247Z",
"state": "PUBLISHED"
},
"dataType": "CVE_RECORD",
"dataVersion": "5.1",
"meta": {
"nvd": "{\"cve\":{\"id\":\"CVE-2018-11862\",\"sourceIdentifier\":\"product-security@qualcomm.com\",\"published\":\"2018-10-29T18:29:01.807\",\"lastModified\":\"2019-04-25T13:06:02.787\",\"vulnStatus\":\"Analyzed\",\"descriptions\":[{\"lang\":\"en\",\"value\":\"Buffer overflow can happen in WLAN module due to lack of validation of the input length in Snapdragon Mobile in version SD 845, SD 850, SDA660.\"},{\"lang\":\"es\",\"value\":\"Puede ocurrir un desbordamiento de b\u00fafer en el m\u00f3dulo WLAN debido a la falta de validaci\u00f3n de la longitud de la entrada en Snapdragon Mobile en versiones SD 845, SD 850 y SDA660.\"}],\"metrics\":{\"cvssMetricV30\":[{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"cvssData\":{\"version\":\"3.0\",\"vectorString\":\"CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H\",\"attackVector\":\"LOCAL\",\"attackComplexity\":\"LOW\",\"privilegesRequired\":\"LOW\",\"userInteraction\":\"NONE\",\"scope\":\"UNCHANGED\",\"confidentialityImpact\":\"HIGH\",\"integrityImpact\":\"HIGH\",\"availabilityImpact\":\"HIGH\",\"baseScore\":7.8,\"baseSeverity\":\"HIGH\"},\"exploitabilityScore\":1.8,\"impactScore\":5.9}],\"cvssMetricV2\":[{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"cvssData\":{\"version\":\"2.0\",\"vectorString\":\"AV:L/AC:L/Au:N/C:C/I:C/A:C\",\"accessVector\":\"LOCAL\",\"accessComplexity\":\"LOW\",\"authentication\":\"NONE\",\"confidentialityImpact\":\"COMPLETE\",\"integrityImpact\":\"COMPLETE\",\"availabilityImpact\":\"COMPLETE\",\"baseScore\":7.2},\"baseSeverity\":\"HIGH\",\"exploitabilityScore\":3.9,\"impactScore\":10.0,\"acInsufInfo\":true,\"obtainAllPrivilege\":false,\"obtainUserPrivilege\":false,\"obtainOtherPrivilege\":false,\"userInteractionRequired\":false}]},\"weaknesses\":[{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"description\":[{\"lang\":\"en\",\"value\":\"CWE-119\"}]}],\"configurations\":[{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"0A2D2B3B-CB28-46AA-9117-A7FA371FDE80\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_845:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"DE18BF66-B0DB-48BB-B43A-56F01821F5A3\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"0C10C7CB-3B66-4F17-8146-6A85611E2BA9\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_850:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"B9DA765F-53DE-4FB0-B825-6C11B3177641\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"A2326BD7-28A5-4244-8501-B109913E7AE6\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sda660:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"532D244B-8B5A-4923-B7F1-9DC0A5FC0E9D\"}]}]}],\"references\":[{\"url\":\"http://www.securityfocus.com/bid/107681\",\"source\":\"product-security@qualcomm.com\",\"tags\":[\"Third Party Advisory\",\"VDB Entry\"]},{\"url\":\"https://www.qualcomm.com/company/product-security/bulletins\",\"source\":\"product-security@qualcomm.com\",\"tags\":[\"Vendor Advisory\"]}]}}"
}
}
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Sightings
| Author | Source | Type | Date |
|---|
Nomenclature
- Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
- Confirmed: The vulnerability is confirmed from an analyst perspective.
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- Patched: This vulnerability was successfully patched by the user reporting the sighting.
- Not exploited: This vulnerability was not exploited or seen by the user reporting the sighting.
- Not confirmed: The user expresses doubt about the veracity of the vulnerability.
- Not patched: This vulnerability was not successfully patched by the user reporting the sighting.