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FKIE_CVE-2018-11862

Vulnerability from fkie_nvd - Published: 2018-10-29 18:29 - Updated: 2026-06-17 01:36
Summary
Buffer overflow can happen in WLAN module due to lack of validation of the input length in Snapdragon Mobile in version SD 845, SD 850, SDA660.

{
  "affected": [
    {
      "affectedData": [
        {
          "product": "Snapdragon Mobile",
          "vendor": "Qualcomm, Inc.",
          "versions": [
            {
              "status": "affected",
              "version": "SD 845, SD 850, SDA660"
            }
          ]
        }
      ],
      "source": "product-security@qualcomm.com"
    }
  ],
  "configurations": [
    {
      "nodes": [
        {
          "cpeMatch": [
            {
              "criteria": "cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*",
              "matchCriteriaId": "0A2D2B3B-CB28-46AA-9117-A7FA371FDE80",
              "vulnerable": true
            }
          ],
          "negate": false,
          "operator": "OR"
        },
        {
          "cpeMatch": [
            {
              "criteria": "cpe:2.3:h:qualcomm:sd_845:-:*:*:*:*:*:*:*",
              "matchCriteriaId": "DE18BF66-B0DB-48BB-B43A-56F01821F5A3",
              "vulnerable": false
            }
          ],
          "negate": false,
          "operator": "OR"
        }
      ],
      "operator": "AND"
    },
    {
      "nodes": [
        {
          "cpeMatch": [
            {
              "criteria": "cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*",
              "matchCriteriaId": "0C10C7CB-3B66-4F17-8146-6A85611E2BA9",
              "vulnerable": true
            }
          ],
          "negate": false,
          "operator": "OR"
        },
        {
          "cpeMatch": [
            {
              "criteria": "cpe:2.3:h:qualcomm:sd_850:-:*:*:*:*:*:*:*",
              "matchCriteriaId": "B9DA765F-53DE-4FB0-B825-6C11B3177641",
              "vulnerable": false
            }
          ],
          "negate": false,
          "operator": "OR"
        }
      ],
      "operator": "AND"
    },
    {
      "nodes": [
        {
          "cpeMatch": [
            {
              "criteria": "cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*",
              "matchCriteriaId": "A2326BD7-28A5-4244-8501-B109913E7AE6",
              "vulnerable": true
            }
          ],
          "negate": false,
          "operator": "OR"
        },
        {
          "cpeMatch": [
            {
              "criteria": "cpe:2.3:h:qualcomm:sda660:-:*:*:*:*:*:*:*",
              "matchCriteriaId": "532D244B-8B5A-4923-B7F1-9DC0A5FC0E9D",
              "vulnerable": false
            }
          ],
          "negate": false,
          "operator": "OR"
        }
      ],
      "operator": "AND"
    }
  ],
  "cveTags": [],
  "descriptions": [
    {
      "lang": "en",
      "value": "Buffer overflow can happen in WLAN module due to lack of validation of the input length in Snapdragon Mobile in version SD 845, SD 850, SDA660."
    },
    {
      "lang": "es",
      "value": "Puede ocurrir un desbordamiento de b\u00fafer en el m\u00f3dulo WLAN debido a la falta de validaci\u00f3n de la longitud de la entrada en Snapdragon Mobile en versiones SD 845, SD 850 y SDA660."
    }
  ],
  "id": "CVE-2018-11862",
  "lastModified": "2026-06-17T01:36:43.573",
  "metrics": {
    "cvssMetricV2": [
      {
        "acInsufInfo": true,
        "baseSeverity": "HIGH",
        "cvssData": {
          "accessComplexity": "LOW",
          "accessVector": "LOCAL",
          "authentication": "NONE",
          "availabilityImpact": "COMPLETE",
          "baseScore": 7.2,
          "confidentialityImpact": "COMPLETE",
          "integrityImpact": "COMPLETE",
          "vectorString": "AV:L/AC:L/Au:N/C:C/I:C/A:C",
          "version": "2.0"
        },
        "exploitabilityScore": 3.9,
        "impactScore": 10.0,
        "obtainAllPrivilege": false,
        "obtainOtherPrivilege": false,
        "obtainUserPrivilege": false,
        "source": "nvd@nist.gov",
        "type": "Primary",
        "userInteractionRequired": false
      }
    ],
    "cvssMetricV30": [
      {
        "cvssData": {
          "attackComplexity": "LOW",
          "attackVector": "LOCAL",
          "availabilityImpact": "HIGH",
          "baseScore": 7.8,
          "baseSeverity": "HIGH",
          "confidentialityImpact": "HIGH",
          "integrityImpact": "HIGH",
          "privilegesRequired": "LOW",
          "scope": "UNCHANGED",
          "userInteraction": "NONE",
          "vectorString": "CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
          "version": "3.0"
        },
        "exploitabilityScore": 1.8,
        "impactScore": 5.9,
        "source": "nvd@nist.gov",
        "type": "Primary"
      }
    ]
  },
  "published": "2018-10-29T18:29:01.807",
  "references": [
    {
      "source": "product-security@qualcomm.com",
      "tags": [
        "Third Party Advisory",
        "VDB Entry"
      ],
      "url": "http://www.securityfocus.com/bid/107681"
    },
    {
      "source": "product-security@qualcomm.com",
      "tags": [
        "Vendor Advisory"
      ],
      "url": "https://www.qualcomm.com/company/product-security/bulletins"
    },
    {
      "source": "af854a3a-2127-422b-91ae-364da2661108",
      "tags": [
        "Third Party Advisory",
        "VDB Entry"
      ],
      "url": "http://www.securityfocus.com/bid/107681"
    },
    {
      "source": "af854a3a-2127-422b-91ae-364da2661108",
      "tags": [
        "Vendor Advisory"
      ],
      "url": "https://www.qualcomm.com/company/product-security/bulletins"
    }
  ],
  "sourceIdentifier": "product-security@qualcomm.com",
  "vulnStatus": "Modified",
  "weaknesses": [
    {
      "description": [
        {
          "lang": "en",
          "value": "CWE-119"
        }
      ],
      "source": "nvd@nist.gov",
      "type": "Primary"
    }
  ]
}



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