github - ghsa-fwm4-v54x-p5vp

ghsa-fwm4-v54x-p5vp

Vulnerability from github

Published

2023-05-02 06:30

Modified

2024-04-04 03:45

Severity ?

7.8 (High) - CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Details

Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it.

Show details on source website

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{
  "affected": [],
  "aliases": [
    "CVE-2022-33292"
  ],
  "database_specific": {
    "cwe_ids": [
      "CWE-416"
    ],
    "github_reviewed": false,
    "github_reviewed_at": null,
    "nvd_published_at": "2023-05-02T06:15:09Z",
    "severity": "HIGH"
  },
  "details": "Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it.",
  "id": "GHSA-fwm4-v54x-p5vp",
  "modified": "2024-04-04T03:45:24Z",
  "published": "2023-05-02T06:30:28Z",
  "references": [
    {
      "type": "ADVISORY",
      "url": "https://nvd.nist.gov/vuln/detail/CVE-2022-33292"
    },
    {
      "type": "WEB",
      "url": "https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin"
    }
  ],
  "schema_version": "1.4.0",
  "severity": [
    {
      "score": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
      "type": "CVSS_V3"
    }
  ]
}

cve-2022-33292

Vulnerability from cvelistv5

Published

2023-05-02 05:08

Modified

2024-08-03 08:01

Severity ?

7.8 (High) - CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Summary

Use after free in Qualcomm IPC

References

▼	URL	Tags
	https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin

Impacted products

▼	Vendor	Product
	Qualcomm, Inc.	Snapdragon

Show details on NVD website

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{
  "containers": {
    "adp": [
      {
        "providerMetadata": {
          "dateUpdated": "2024-08-03T08:01:20.553Z",
          "orgId": "af854a3a-2127-422b-91ae-364da2661108",
          "shortName": "CVE"
        },
        "references": [
          {
            "tags": [
              "x_transferred"
            ],
            "url": "https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin"
          }
        ],
        "title": "CVE Program Container"
      }
    ],
    "cna": {
      "affected": [
        {
          "defaultStatus": "unaffected",
          "platforms": [
            "Snapdragon Compute",
            "Snapdragon Mobile"
          ],
          "product": "Snapdragon",
          "vendor": "Qualcomm, Inc.",
          "versions": [
            {
              "status": "affected",
              "version": "SG4150P"
            },
            {
              "status": "affected",
              "version": "Snapdragon 680 4G Mobile Platform"
            },
            {
              "status": "affected",
              "version": "Snapdragon 685 4G Mobile Platform (SM6225-AD)"
            },
            {
              "status": "affected",
              "version": "WCD9370"
            },
            {
              "status": "affected",
              "version": "WCD9375"
            },
            {
              "status": "affected",
              "version": "WCN3950"
            },
            {
              "status": "affected",
              "version": "WCN3988"
            },
            {
              "status": "affected",
              "version": "WSA8810"
            }
          ]
        }
      ],
      "descriptions": [
        {
          "lang": "en",
          "value": "Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it."
        }
      ],
      "metrics": [
        {
          "cvssV3_1": {
            "attackComplexity": "LOW",
            "attackVector": "LOCAL",
            "availabilityImpact": "HIGH",
            "baseScore": 7.8,
            "baseSeverity": "HIGH",
            "confidentialityImpact": "HIGH",
            "integrityImpact": "HIGH",
            "privilegesRequired": "LOW",
            "scope": "UNCHANGED",
            "userInteraction": "NONE",
            "vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
            "version": "3.1"
          },
          "format": "CVSS",
          "scenarios": [
            {
              "lang": "en",
              "value": "GENERAL"
            }
          ]
        }
      ],
      "problemTypes": [
        {
          "descriptions": [
            {
              "cweId": "CWE-416",
              "description": "CWE-416 Use After Free",
              "lang": "en",
              "type": "CWE"
            }
          ]
        }
      ],
      "providerMetadata": {
        "dateUpdated": "2024-04-12T16:27:33.874Z",
        "orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
        "shortName": "qualcomm"
      },
      "references": [
        {
          "url": "https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin"
        }
      ],
      "title": "Use after free in Qualcomm IPC"
    }
  },
  "cveMetadata": {
    "assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
    "assignerShortName": "qualcomm",
    "cveId": "CVE-2022-33292",
    "datePublished": "2023-05-02T05:08:45.337Z",
    "dateReserved": "2022-06-14T10:44:39.610Z",
    "dateUpdated": "2024-08-03T08:01:20.553Z",
    "state": "PUBLISHED"
  },
  "dataType": "CVE_RECORD",
  "dataVersion": "5.1"
}

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