CVE-2022-33292 (GCVE-0-2022-33292)
Vulnerability from cvelistv5 – Published: 2023-05-02 05:08 – Updated: 2024-08-03 08:01
VLAI
EPSS
VEX
Title
Use after free in Qualcomm IPC
Summary
Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it.
Severity
7.8 (High)
CWE
- CWE-416 - Use After Free
Assigner
References
1 reference
Impacted products
1 product
| Vendor | Product | Version | CPE status | |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon |
Affected:
SG4150P
Affected: Snapdragon 680 4G Mobile Platform Affected: Snapdragon 685 4G Mobile Platform (SM6225-AD) Affected: WCD9370 Affected: WCD9375 Affected: WCN3950 Affected: WCN3988 Affected: WSA8810 |
guessed |
{
"containers": {
"adp": [
{
"providerMetadata": {
"dateUpdated": "2024-08-03T08:01:20.553Z",
"orgId": "af854a3a-2127-422b-91ae-364da2661108",
"shortName": "CVE"
},
"references": [
{
"tags": [
"x_transferred"
],
"url": "https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin"
}
],
"title": "CVE Program Container"
}
],
"cna": {
"affected": [
{
"defaultStatus": "unaffected",
"platforms": [
"Snapdragon Compute",
"Snapdragon Mobile"
],
"product": "Snapdragon",
"vendor": "Qualcomm, Inc.",
"versions": [
{
"status": "affected",
"version": "SG4150P"
},
{
"status": "affected",
"version": "Snapdragon 680 4G Mobile Platform"
},
{
"status": "affected",
"version": "Snapdragon 685 4G Mobile Platform (SM6225-AD)"
},
{
"status": "affected",
"version": "WCD9370"
},
{
"status": "affected",
"version": "WCD9375"
},
{
"status": "affected",
"version": "WCN3950"
},
{
"status": "affected",
"version": "WCN3988"
},
{
"status": "affected",
"version": "WSA8810"
}
]
}
],
"descriptions": [
{
"lang": "en",
"value": "Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it."
}
],
"metrics": [
{
"cvssV3_1": {
"attackComplexity": "LOW",
"attackVector": "LOCAL",
"availabilityImpact": "HIGH",
"baseScore": 7.8,
"baseSeverity": "HIGH",
"confidentialityImpact": "HIGH",
"integrityImpact": "HIGH",
"privilegesRequired": "LOW",
"scope": "UNCHANGED",
"userInteraction": "NONE",
"vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
"version": "3.1"
},
"format": "CVSS",
"scenarios": [
{
"lang": "en",
"value": "GENERAL"
}
]
}
],
"problemTypes": [
{
"descriptions": [
{
"cweId": "CWE-416",
"description": "CWE-416 Use After Free",
"lang": "en",
"type": "CWE"
}
]
}
],
"providerMetadata": {
"dateUpdated": "2024-04-12T16:27:33.874Z",
"orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
"shortName": "qualcomm"
},
"references": [
{
"url": "https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin"
}
],
"title": "Use after free in Qualcomm IPC"
}
},
"cveMetadata": {
"assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
"assignerShortName": "qualcomm",
"cveId": "CVE-2022-33292",
"datePublished": "2023-05-02T05:08:45.337Z",
"dateReserved": "2022-06-14T10:44:39.610Z",
"dateUpdated": "2024-08-03T08:01:20.553Z",
"state": "PUBLISHED"
},
"dataType": "CVE_RECORD",
"dataVersion": "5.1",
"vulnerability-lookup:meta": {
"epss": {
"cve": "CVE-2022-33292",
"date": "2026-09-27",
"epss": "0.00116",
"percentile": "0.01453"
},
"fkie_nvd": {
"configurations": [
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:sg4150p_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "9279F02F-6C30-4891-8941-97003DE9C8C7",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:sg4150p:-:*:*:*:*:*:*:*",
"matchCriteriaId": "FFA7BB42-305C-451F-92D8-0718DF68A012",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:sm6225_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "EC2668D5-623D-4E13-AF37-6F7040A14007",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:sm6225:-:*:*:*:*:*:*:*",
"matchCriteriaId": "72B0F4C7-CA0F-4B9C-A6AA-60934B2AB2C2",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:sm6225-ad_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "E089DC83-3849-4671-95B9-E4C958EC79FB",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:sm6225-ad:-:*:*:*:*:*:*:*",
"matchCriteriaId": "E38F8F04-F841-492B-A555-96DBD7461380",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "1295D869-F4DD-4766-B4AA-3513752F43B4",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:wcd9370:-:*:*:*:*:*:*:*",
"matchCriteriaId": "B98784DC-3143-4D38-AD28-DBBDCCAB4272",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "34143ABA-7D09-429F-A65C-3A33438BF62C",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:wcd9375:-:*:*:*:*:*:*:*",
"matchCriteriaId": "9D56DFE3-5EF1-4B23-BBD5-0203FBF9CCEC",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "3FEF2DB6-00F5-4B07-953B-EF58B31267F1",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:wcn3950:-:*:*:*:*:*:*:*",
"matchCriteriaId": "120E8F0F-EBEB-4565-9927-2D473F783EF7",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "E4BFB25F-013B-48E3-99FF-3E8687F94423",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:wcn3988:-:*:*:*:*:*:*:*",
"matchCriteriaId": "BF676C5B-838B-446C-A689-6A25AB8A87E2",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "15307882-7039-43E9-9BA3-035045988B99",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:wsa8810:-:*:*:*:*:*:*:*",
"matchCriteriaId": "AA85B322-E593-4499-829A-CC6D70BAE884",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
}
],
"descriptions": [
{
"lang": "en",
"value": "Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it."
}
],
"id": "CVE-2022-33292",
"lastModified": "2024-11-21T07:08:05.440",
"metrics": {
"cvssMetricV31": [
{
"cvssData": {
"attackComplexity": "LOW",
"attackVector": "LOCAL",
"availabilityImpact": "HIGH",
"baseScore": 7.8,
"baseSeverity": "HIGH",
"confidentialityImpact": "HIGH",
"integrityImpact": "HIGH",
"privilegesRequired": "LOW",
"scope": "UNCHANGED",
"userInteraction": "NONE",
"vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
"version": "3.1"
},
"exploitabilityScore": 1.8,
"impactScore": 5.9,
"source": "product-security@qualcomm.com",
"type": "Secondary"
},
{
"cvssData": {
"attackComplexity": "LOW",
"attackVector": "LOCAL",
"availabilityImpact": "HIGH",
"baseScore": 7.8,
"baseSeverity": "HIGH",
"confidentialityImpact": "HIGH",
"integrityImpact": "HIGH",
"privilegesRequired": "LOW",
"scope": "UNCHANGED",
"userInteraction": "NONE",
"vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
"version": "3.1"
},
"exploitabilityScore": 1.8,
"impactScore": 5.9,
"source": "nvd@nist.gov",
"type": "Primary"
}
]
},
"published": "2023-05-02T06:15:09.757",
"references": [
{
"source": "product-security@qualcomm.com",
"tags": [
"Patch",
"Vendor Advisory"
],
"url": "https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin"
},
{
"source": "af854a3a-2127-422b-91ae-364da2661108",
"tags": [
"Patch",
"Vendor Advisory"
],
"url": "https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin"
}
],
"sourceIdentifier": "product-security@qualcomm.com",
"vulnStatus": "Modified",
"weaknesses": [
{
"description": [
{
"lang": "en",
"value": "CWE-416"
}
],
"source": "product-security@qualcomm.com",
"type": "Secondary"
},
{
"description": [
{
"lang": "en",
"value": "CWE-416"
}
],
"source": "nvd@nist.gov",
"type": "Primary"
}
]
},
"nvd": {
"cve": {
"affected": [
{
"affectedData": [
{
"defaultStatus": "unaffected",
"platforms": [
"Snapdragon Compute",
"Snapdragon Mobile"
],
"product": "Snapdragon",
"vendor": "Qualcomm, Inc.",
"versions": [
{
"status": "affected",
"version": "SG4150P"
},
{
"status": "affected",
"version": "Snapdragon 680 4G Mobile Platform"
},
{
"status": "affected",
"version": "Snapdragon 685 4G Mobile Platform (SM6225-AD)"
},
{
"status": "affected",
"version": "WCD9370"
},
{
"status": "affected",
"version": "WCD9375"
},
{
"status": "affected",
"version": "WCN3950"
},
{
"status": "affected",
"version": "WCN3988"
},
{
"status": "affected",
"version": "WSA8810"
}
]
}
],
"source": "product-security@qualcomm.com"
}
],
"configurations": [
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:sg4150p_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "9279F02F-6C30-4891-8941-97003DE9C8C7",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:sg4150p:-:*:*:*:*:*:*:*",
"matchCriteriaId": "FFA7BB42-305C-451F-92D8-0718DF68A012",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:sm6225_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "EC2668D5-623D-4E13-AF37-6F7040A14007",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:sm6225:-:*:*:*:*:*:*:*",
"matchCriteriaId": "72B0F4C7-CA0F-4B9C-A6AA-60934B2AB2C2",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:sm6225-ad_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "E089DC83-3849-4671-95B9-E4C958EC79FB",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:sm6225-ad:-:*:*:*:*:*:*:*",
"matchCriteriaId": "E38F8F04-F841-492B-A555-96DBD7461380",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "1295D869-F4DD-4766-B4AA-3513752F43B4",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:wcd9370:-:*:*:*:*:*:*:*",
"matchCriteriaId": "B98784DC-3143-4D38-AD28-DBBDCCAB4272",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "34143ABA-7D09-429F-A65C-3A33438BF62C",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:wcd9375:-:*:*:*:*:*:*:*",
"matchCriteriaId": "9D56DFE3-5EF1-4B23-BBD5-0203FBF9CCEC",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "3FEF2DB6-00F5-4B07-953B-EF58B31267F1",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:wcn3950:-:*:*:*:*:*:*:*",
"matchCriteriaId": "120E8F0F-EBEB-4565-9927-2D473F783EF7",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "E4BFB25F-013B-48E3-99FF-3E8687F94423",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:wcn3988:-:*:*:*:*:*:*:*",
"matchCriteriaId": "BF676C5B-838B-446C-A689-6A25AB8A87E2",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "15307882-7039-43E9-9BA3-035045988B99",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:wsa8810:-:*:*:*:*:*:*:*",
"matchCriteriaId": "AA85B322-E593-4499-829A-CC6D70BAE884",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
}
],
"cveTags": [],
"descriptions": [
{
"lang": "en",
"value": "Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it."
}
],
"id": "CVE-2022-33292",
"lastModified": "2026-06-17T04:49:01.527",
"metrics": {
"cvssMetricV31": [
{
"cvssData": {
"attackComplexity": "LOW",
"attackVector": "LOCAL",
"availabilityImpact": "HIGH",
"baseScore": 7.8,
"baseSeverity": "HIGH",
"confidentialityImpact": "HIGH",
"integrityImpact": "HIGH",
"privilegesRequired": "LOW",
"scope": "UNCHANGED",
"userInteraction": "NONE",
"vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
"version": "3.1"
},
"exploitabilityScore": 1.8,
"impactScore": 5.9,
"source": "product-security@qualcomm.com",
"type": "Secondary"
},
{
"cvssData": {
"attackComplexity": "LOW",
"attackVector": "LOCAL",
"availabilityImpact": "HIGH",
"baseScore": 7.8,
"baseSeverity": "HIGH",
"confidentialityImpact": "HIGH",
"integrityImpact": "HIGH",
"privilegesRequired": "LOW",
"scope": "UNCHANGED",
"userInteraction": "NONE",
"vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
"version": "3.1"
},
"exploitabilityScore": 1.8,
"impactScore": 5.9,
"source": "nvd@nist.gov",
"type": "Primary"
}
]
},
"published": "2023-05-02T06:15:09.757",
"references": [
{
"source": "product-security@qualcomm.com",
"tags": [
"Patch",
"Vendor Advisory"
],
"url": "https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin"
},
{
"source": "af854a3a-2127-422b-91ae-364da2661108",
"tags": [
"Patch",
"Vendor Advisory"
],
"url": "https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin"
}
],
"sourceIdentifier": "product-security@qualcomm.com",
"vulnStatus": "Modified",
"weaknesses": [
{
"description": [
{
"lang": "en",
"value": "CWE-416"
}
],
"source": "product-security@qualcomm.com",
"type": "Secondary"
},
{
"description": [
{
"lang": "en",
"value": "CWE-416"
}
],
"source": "nvd@nist.gov",
"type": "Primary"
}
]
}
}
}
}
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Experimental. This forecast is provided for visualization only and may change without notice. Do not use it for operational decisions.
Forecast uses a logistic model when the trend is rising, or an exponential decay model when the trend is falling. Fitted via linearized least squares.
Sightings
| Author | Source | Type | Date | Other |
|---|
Nomenclature
- Seen: The vulnerability was mentioned, discussed, or observed by the user.
- Confirmed: The vulnerability has been validated from an analyst's perspective.
- Published Proof of Concept: A public proof of concept is available for this vulnerability.
- Exploited: The vulnerability was observed as exploited by the user who reported the sighting.
- Patched: The vulnerability was observed as successfully patched by the user who reported the sighting.
- Not exploited: The vulnerability was not observed as exploited by the user who reported the sighting.
- Not confirmed: The user expressed doubt about the validity of the vulnerability.
- Not patched: The vulnerability was not observed as successfully patched by the user who reported the sighting.
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The MITRE ATT&CK techniques below are AI-generated suggestions, inferred from the description of the
vulnerability by the CIRCL/vulnerability-attack-technique-classification-roberta-base
model, served locally by ML-Gateway.
They have not been verified by an analyst and are provided for guidance only.
The approach is described in our paper Mapping CVEs to MITRE ATT&CK Techniques: A Curated Gold-Set Classifier and the Limits of LLM-Assisted Label Expansion.
Browse all ATT&CK techniques and the vulnerabilities related to each.
The approach is described in our paper Mapping CVEs to MITRE ATT&CK Techniques: A Curated Gold-Set Classifier and the Limits of LLM-Assisted Label Expansion.
Browse all ATT&CK techniques and the vulnerabilities related to each.
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Related by attack behaviour
Vulnerabilities whose description is nearest to this one in the vector space of the CIRCL/vulnerability-attack-technique-biencoder model. This is a similarity search over the bi-encoder space (plain cosine), not a classification, and it has no measured accuracy.
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